Technical specifications

For a list of supported processors, see Lenovo ServerProven website.

See Memory module installation rules and order for detailed information about memory configuration and setup.

For a list of supported memory modules, see: Lenovo ServerProven website.

• ThinkEdge SE350 V2 supports up to two 80 mm (2280) M.2 PCIe Gen3x1 on the I/O module board for boot functions.

ThinkEdge SE350 V2 supports one of the following storage configurations:

• Up to four 7mm 2.5-inch hot-swap drives, supporting SATA or NVMe drives
• Up to two 15mm 2.5-inch hot-swap drives, supporting NVMe drives

ThinkEdge SE350 V2 supports one of the following groups of network connectors on I/O module board:

• 10/25GbE I/O module board
  • Four 10/25GbE SFP28 connectors
    Note

    The transmission speed of SFP28 connectors could be 10 Gbps or 25 Gbps, depending on the processor selected. Processors with at least 16 cores support transmission speed of 25 Gbps.
  • Two 2.5GbE RJ-45 connectors
  • One XCC system management port (10/100/1000 Mbps RJ-45)
• 1GbE I/O module board
  • Four 1GbE RJ-45 connectors
  • Two 2.5GbE RJ-45 connectors
  • One XCC system management port (10/100/1000 Mbps RJ-45)

• Lenovo XClarity Controller (XCC), which provides service processor control and monitoring functions, video controller, and remote keyboard, video, mouse, and remote drive capabilities.

  • ThinkEdge SE350 V2 supports Lenovo XClarity Controller 2 (XCC2). For additional information about Lenovo XClarity Controller 2 (XCC2), refer to Lenovo XClarity Controller portal page.

• One XCC system management port (10/100/1000 Mbps RJ-45) on the front side to connect to a systems-management network. This RJ-45 connector is dedicated to the Lenovo XClarity Controller functions.
• One USB 2.0 Gen 1 Type-C connector with Lenovo XClarity Controller (XCC) management on the front to connect to a system-management network.

• Depending on the configuration, the I/O connectors on the front of the server include:

  • 10/25GbE I/O module board

    • Two USB 3.2 Gen 1 Type-A connectors
    • One USB 3.2 Gen 1 Type-C connector (supporting display)
    • One USB 2.0 Gen 1 Type-C connector with Lenovo XClarity Controller (XCC) management
    • Two 2.5GbE RJ-45 connectors
    • Four 10/25GbE SFP28 connectors
      Note

      The transmission speed of SFP28 connectors could be 10 Gbps or 25 Gbps, depending on the processor selected. Processors with at least 16 cores support transmission speed of 25 Gbps.

  • 1GbE I/O module board

    • Two USB 3.2 Gen 1 Type-A connectors
    • One USB 3.2 Gen 1 Type-C connector (supporting display)
    • One USB 2.0 Gen 1 Type-C connector with Lenovo XClarity Controller (XCC) management
    • Two 2.5GbE RJ-45 connectors
    • Four 1GbE RJ-45 connectors

• Software RAID 0, 1, 5, 10

  • Intel VROC SATA RAID: supports RAID level 0, 1
  • Intel VROC NVMe RAID
    • VROC Standard: supports RAID level 0, 1, 10 and requires an activation key.
    • VROC Premium: supports RAID level 0, 1, 5, 10 and requires an activation key.
  Note

  • For more information about RAID configuration, see RAID configuration.

  • For more information about acquiring and installing the activation key, see Lenovo Features on Demand website.

• Three 40 mm non-hot-swappable fans

• The models with DC/DC power module board (Output 12V): one of the following

  • Dual 12-48V variable DC power source input
    Note

    To connect DC power source with ThinkEdge SE350 V2 DC Terminal Block Cable, see DC terminal block cable for more information.

  • Up to two 300W (230V/115V) external power adapters
    Note

    • When 300W external power adapter is installed, one of the following mounting options is supported with proper ambient temperature:

      • Desktop mount at lower than 40°C
      • Rack mount with ThinkEdge SE350 V2 1U2N Enclosure at lower than 30°C
      • Rack mount with ThinkEdge SE350 V2 2U2N Enclosure at lower than 40°C
• The models with internal power supply:

  • Single 500W (230V/115V) AC power source input

• Supported external power adapters:

  As required by COMMISSION REGULATION (EU) 2019/1782 of 1 October 2019 laying down ecodesign requirements for external power supplies pursuant to Directive 2009/125/EC of the European Parliament and of the Council and repealing Commission Regulation (EC) No 278/2009 (ErP Lot7) for the external power supply of the product.

  • ThinkEdge 300W 230V/115V External Power Supply

• One DRAM memory module in slot 1
• Depending on the model, one of the following power source:

  • One 300W external power adapter
  • AC power source input
  • DC power source input
• One 2280 NVMe M.2 drive in slot 1 on the I/O module board
• Three non-hot-swappable system fans