Technical rules for thermal limitation

This topic provides thermal rules for processors, system fans, heat sinks and other parts.

Server models with front drive bays only

This section provides thermal information for server models with front drive bays only.

Front bays	Max. Ambient Temp. (at sea level)	CPU TDP¹ (watts)	Heat sink	Air baffle	Fan type	Max. DIMM Qty.
Front bays	Max. Ambient Temp. (at sea level)	CPU TDP¹ (watts)	Heat sink	Air baffle	Fan type	DRAM²	PMEM³
4 x 3.5" 4 x 2.5" 8 x 2.5" 10 x 2.5"	45°C	TDP ≤ 125	Standard	√	Standard	32	16
	45°C	125 < TDP ≤ 165	Standard	√	Standard	32	16
	35°C	165 < TDP ≤ 205	Standard	√	Performance	32	16
	30°C	205 < TDP ≤ 250	T-shape	x	Performance	32	16
	30°C	250 < TDP ≤ 270	T-shape	x	Performance	32	16
10 x 2.5" U.2 16 x EDSFF	35°C	TDP ≤ 125	Standard	√	Performance	32	16
	35°C	125 < TDP ≤ 165	Standard	√	Performance	32	16
	35°C	165 < TDP ≤ 205	Standard	√	Performance	32	16
	30°C	205 < TDP ≤ 250	T-shape	x	Performance	32	16

Note

For 6334, 4310T, 6338T, and 5320T processors, performance heat sinks must be used.
When a 256 GB 3DS RDIMM or 256 GB PMEM is installed, the ambient temperature must be limited to 30°C or lower.
The capacity of 3DS RDIMM and PMEM supported is not greater than 256 GB.

This section provides thermal information for server models with middle or rear drive bays.

Front bays	Rear bays	Max. Ambient Temp. (at sea level)	CPU TDP¹ (watts)	Heat sink	Air baffle	Fan type	Max. DIMM Qty.
Front bays	Rear bays	Max. Ambient Temp. (at sea level)	CPU TDP¹ (watts)	Heat sink	Air baffle	Fan type	DRAM²	PMEM
4 x 3.5" 4 x 2.5" 8 x 2.5" 10 x 2.5"	2 x 2.5" SAS/SATA/U.2	Rear SAS/SATA: 35°C Rear U.2: 30°C	TDP ≤ 125	Standard	√	Performance	32	x
			125 < TDP ≤ 165	Standard	√	Performance	32	x
			165 < TDP ≤ 205	Standard	√	Performance	32	x

Note

For 6334, 4310T, 6338T, and 5320T processors, performance heat sinks must be used.
When a 256 GB 3DS RDIMM, the ambient temperature must be limited to 30°C or lower, and the capacity of 3DS RDIMM supported is not greater than 256 GB.

This section provides thermal information for server models with GPUs.

Note

Up to one P2200 GPU adapter is supported, while a maximum of three T4, L4, P620 or A2 GPU adapters are supported.
All GPUs installed must be identical.

Front bays	Max. Ambient Temp. (at sea level)	CPU TDP¹ (watts)	Heat sink	Air baffle	Fan type	Max. DIMM Qty.
Front bays	Max. Ambient Temp. (at sea level)	CPU TDP¹ (watts)	Heat sink	Air baffle	Fan type	DRAM²	PMEM³
4 x 3.5" 4 x 2.5" 8 x 2.5" 10 x 2.5"	Active GPUs: 35°C Passive GPUs: 30°C	TDP ≤ 125	Standard	√	Performance	32	16
		125 < TDP ≤ 165	Standard	√	Performance	32	16
		165 < TDP ≤ 205	Standard	√	Performance	32	16
	30°C⁴	205 < TDP ≤ 220	T-shape	x	Performance	32	16
4 x 2.5"⁵	Active GPUs: 35°C Passive GPUs: 30°C	220 < TDP ≤ 270	T-shape	x	Performance	32	16

Note

For 6334, 4310T, 6338T, and 5320T processors, performance heat sinks must be used.
When a 256 GB 3DS RDIMM or 256 GB PMEM is installed, the ambient temperature must be limited to 30°C or lower.
The capacity of 3DS RDIMM and PMEM supported is not greater than 256 GB.
When the processor TDP is within the range between 205 W (not included) to 220 W, the ambient temperature must be limited to 30°C or lower, regardless of which GPU is installed.
When the processor TDP is within the range between 220 W (not included) to 270 W, only 4 x 2.5-inch SAS/SATA front backplane is supported.

Use following topics to learn about the technical rules for system fans and GPUs:

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