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Remove a processor

This task has instructions for removing an assembled processor. This task requires a Torx T30 driver.

About this task

Required tools

Make sure you have the required tools listed below in hand to properly replace the component.

  • Water loop kits

    • SD650-N V3 Water Loop Gap Pad Kit (The water loop carrier in the Service Kit is reusable, it is recommended to keep it at the facility where the server operates for future replacement needs.)

    • SD650-N V3 Water Loop Putty Pad Kit

    • SD650-N V3 OSFP Putty Pad Kit

    • VR Conduction Plate Parts

  • Drive gap pad or putty pad kits according to the drives installed in the tray. See their respective replacement procedures for more information.

  • Screws and screwdrivers

    Prepare the following screwdrivers to ensure you can install and remove corresponding screws properly.
    Screwdriver TypeScrew Type
    Hex screw4.5 mm hex head screwdriver
    3/16" hex head screwdriverhex head screwdriver (power distribution board)
    Torx T10 head screwdriverTorx T10 screw
    Torx T30 head screwdriverTorx T30 screw
    Phillips #1 head screwdriverPhillips #1 screw
    Phillips #2 head screwdriverPhillips #2 screw
Attention

  • Read Installation Guidelines and Safety inspection checklist to ensure that you work safely.

  • Turn off the corresponding DWC tray that you are going to perform the task on.

  • Disconnect all external cables from the enclosure.

  • Use extra force to disconnect QSFP cables if they are connected to the solution.

  • Each processor socket must always contain a cover. When removing or installing a processor, protect empty processor sockets with a cover.

  • Do not touch the processor socket or processor contacts. Processor-socket contacts are very fragile and easily damaged. Contaminants on the processor contacts, such as oil from your skin, can cause connection failures.

  • Do not allow the thermal grease on the processor or water loop to come in contact with anything. Contact with any surface can compromise the thermal grease, rendering it ineffective. Thermal grease can damage components, such as electrical connectors in the processor socket. Do not remove the grease cover from the cold plate until you are instructed to do so.

  • Before you install a new or replace a processor, update your system firmware to the latest level. See Update the firmware.

  • To avoid damaging the water loop, always use the water loop carrier when removing, installing or folding the water loop.

Figure 1. Processor locations
Processor locations
Watch the procedure
  • A video of this procedure is available at YouTube.

Procedure

Note
Depending on the model, your solution might look slightly different from the illustration.

  1. Make preparations for this task.
    1. Remove the tray from the enclosure. See Remove a DWC tray from the enclosure.
    2. Remove the tray cover. See Remove the tray cover.
    3. Remove the cross braces. See Remove the cross braces.
    4. Remove the DIMM comb. See Remove a DIMM comb.
    5. Remove memory modules. See Remove a memory module.
    6. Remove the M.2 backplane assembly. See Remove the M.2 backplane assembly.
      Note
      The M.2 backplane cold plate needs to be removed as well.
    7. Remove the bus bar. See Remove the bus bar.
    8. Remove the MCIO cables. Follow the guidance and routing information in Internal cable routing.
    9. Remove the drive cage. Depending the system configurations, see Remove a drive cage assembly, Remove a 7mm NVMe drive cage assembly, or Remove the E3.S drive cage assembly.
    10. Remove the OSFP module. See Remove the OSFP module.
  2. Remove the two Hex screws from the OSFP module with a 4.5 mm hex head screwdriver.
    Figure 2. OSFP module conduction plate Hex screws removal
    OSFP module conduction plate Hex screws removal
  3. Remove the OSFP module conduction plate. With alcohol cleaning pads, wipe of any remaining putty pads from the conduction plate.
    Screw TypeScrewdriver Type
    1 M3x5 screw (x3)Phillips #1 head screwdriver
    2 M3 screw (x2)T10 screwdriver
    Figure 3. OSFP module conduction plate removal
    Removing the OSFP module conduction plate
  4. Remove two Torx T10 screws (per node); then, remove the VR (voltage regulator) clamp plate out of the node.
    Figure 4. VR clamp plate removal
    VR clamp plate removal
  5. Remove water loop screws (x9 Torx T10 screws for two nodes) with a torque screwdriver set to the proper torque.
    Note
    For reference, the torque required for the screws to be fully tightened/removed is 5.0+/- 0.5 lbf-in, 0.55+/- 0.05 N-M.
    Figure 5. Water loop screw removal
    Water loop screw removal
  6. Remove Torx T10 screws (x7 screws) to loosen the quick connect.
    Note
    For reference, the torque required for the screws to be fully tightened/removed is 5.0+/- 0.5 lbf-in, 0.55+/- 0.05 N-M.
    Figure 6. Quick connect screw removal (Compute node)

  7. Orient two water loop carriers with the guide pins; then, gently put the two water loop carriers down and ensure they are seated firmly on the water loop.
    Figure 7. Water loop carrier installation
    Water loop carrier installation
  8. Tighten water loop carrier screws (x12 Phillips #2 screws).
    Figure 8. Water loop carrier screws installation
    Water loop carrier screws installation
  9. Loosen processors properly.
    1. Fully loosen all Torx T30 captive screws (x8 Torx T30 captive screws) on cold plates with a general screwdriver, following the removal sequence shown on the cold plate label.
      Note
      For reference, the torque required for the screws to be fully tightened/removed is 10+/- 2.0 lbf-in, 1.1+/- 0.2 N-m.
      Attention
      To prevent damage to components, make sure that you follow the indicated loosening sequence.
    2. Rotate all anti-tilt wire bails (16x anti-tilt wire bails for two nodes) inwards to the unlocked position.

      Figure 9. Loosening Torx T30 captive screws
      Loosening Torx T30 captive screws
  10. Carefully rotate the water loop so one half is sitting on top of the other half.
    Figure 10. Folding the water loop
    Folding the water loop
  11. Remove the processor from the retainer. This process differs by processor SKU. Check the processor SKU and follow the applicable procedure.
    Note
    Do not touch the contacts on the processor.
    For non Intel® Xeon® CPU Max processor

    1. Lift the handle to release the processor from the retainer.

    2. Carefully hold the processor by its edges; then, lift the processor from the retainer.

      Figure 11. Processor removal
      Processor removal
    For Intel® Xeon® CPU Max processor

    1. Insert a flat head screwdriver into the TIM breaking cam on the retainer; then, slightly rotate the flat head screwdriver to release the processor from the retainer.

    2. Carefully hold the processor by its edges; then, lift the processor from the retainer.

      Figure 12. Processor removal (Intel® Xeon® CPU Max processor)
      processor removal for Intel Xeon CPU Max processor
      1 TIM breaking cam
  12. Without putting the processor down, wipe the thermal grease from the top of the processor with an alcohol cleaning pad; then, place the processor on a static protective surface with the processor-contact side up.
  13. Remove the processor retainer from the underside of the cold plate.
    Note
    The processor retainer will be discarded and replaced with a new one.
    1. Carefully release the retaining clips from the cold plate.
    2. Lift the retainer from the cold plate.
    Figure 13. Processor retainer removal
    Processor retainer removal
  14. Wipe the thermal grease from the bottom of the cold plate with an alcohol cleaning pad.
After you finish

  • If you are instructed to return the component or optional device, follow all packaging instructions, and use any packaging materials for shipping that are supplied to you.