Parts list
Use the parts list to identify each of the components that are available for your server.
For more information about ordering the parts shown in Figure 1, go to:
T1: Tier 1 customer replaceable unit (CRU). Replacement of Tier 1 CRUs is your responsibility. If Lenovo installs a Tier 1 CRU at your request with no service agreement, you will be charged for the installation.
T2: Tier 2 customer replaceable unit (CRU). You may install a Tier 2 CRU yourself or request Lenovo to install it, at no additional charge, under the type of warranty service that is designated for your server.
F: Field replaceable unit (FRU). FRUs must be installed only by trained service technicians.
C: Consumable and Structural parts. Purchase and replacement of consumable and structural parts (components, such as a cover or bezel) is your responsibility. If Lenovo acquires or installs a structural component at your request, you will be charged for the service.
| Description | Type | Description | Type |
|---|---|---|---|
| 1 Top cover | T1 | 2 Air baffle | C |
| 3 RAID adapter on the system board | T1 | 4 LOM adapter | T1 |
| 5 Riser 1 bracket (two low-profile slots) | T1 | 6 Riser 2 bracket (one low-profile slot) | T1 |
| 7 Riser 1 bracket (one low-profile slot and one full-height half-length slot) | T1 | 8 Serial port module | T1 |
| 9 Riser card | T1 | 10 TCM/TPM adapter (only available in Chinese Mainland) | F |
| 11 System board | F | 12 M.2 retainer | T1 |
| 13 M.2 drive backplane | T1 | 14 M.2 drive | T1 |
| 15 RAID super capacitor module | T1 | 16 RAID super capacitor module holder | C |
| 17 Rear hot-swap drive cage | C | 18 Rear backplane | T1 |
| 19 Power supply | T1 | 20 Power supply filler | C |
| 21 Chassis with four 3.5-inch drive baysChassis with eight 2.5-inch drive baysChassis with ten 2.5-inch drive bays | F | 22 PCIe adapter | T1 |
| 23 Security bezel | T1 | 24 Front I/O assembly for server models with four 3.5-inch drive bays | T1 |
| 25 Front I/O assembly for server models with eight 2.5-inch drive bays | T1 | 26 Front I/O assembly for server models with ten 2.5-inch drive bays | T1 |
| 27 2.5-inch drive filler | C | 28 2.5-inch hot-swap drive | T1 |
| 29 3.5-inch drive filler | C | 30 3.5-inch hot-swap drive | T1 |
| 31 System fan | T1 | 32 CMOS battery | C |
| 33 Backplane for server models with ten 2.5-inch drive bays | T1 | 34 Backplane for server models with eight 2.5-inch drive bays | T1 |
| 35 Backplane for server models with four 3.5-inch drive bays | T1 | 36 Memory module (DCPMM module might look slightly different from the illustration.) | T1 |
| 38 Processor | F | 38 Heat sink | F |