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Thermal pad installation guidelines

Follow the information in this section to identify the shape, location, orientation and instruction of the thermal pads used in SE100.

Note
  • If a thermal pad is in any of the following conditions, replace the thermal pad with a new one.
    • The thermal pad is damaged or detached from the surface.
    • The new part to be installed is of different brand or form factor from the replaced one; the new part might cause thermal pads to be deformed or damaged.
  • Before replacing the thermal pad, gently clean the interface plate and the hardware surface with an alcohol cleaning pad.
  • Hold the thermal pad carefully to avoid deformation. Make sure no screw hole or opening is blocked by the thermal pad.
  • Do not use expired thermal pads. Check the manufacturing date on the thermal pad package and make sure it does not exceed 1 year. If the thermal pads are expired, order new thermal pads for proper replacement.

Thermal pad identification and location​

See the following for the thermal pads used in SE100:

  • Top cover thermal pad kits

  • Bottom cover thermal pad kits

  • System board thermal pad kits

Figure 1. Thermal pad identification and location: Top cover

Figure 2. Thermal pad identification and location: Bottom cover

Figure 3. Thermal pad identification and location: System board

Table 1. Thermal pad identification and location
Component installation requiring the padsPad numberPad orientationPad replacement procedure

  • Top cover

  • System board

  • Processor heat sink

1 5 6Pink side facing outward.
  1. Peel off the transparent plastic film on the gray side of the pad, and attach this side to the top cover.
  2. After the pad is attached to the top cover, remove the other plastic film from the pad.
2 3Keep the pink side facing up, peel off the plastic film from the bottom side; then attach the pad to the top cover.
4Glossy side facing outward.Peel off the plastic film of the pad, and attach the pad to the top cover.

  • Bottom cover

  • System board

  • Processor heat sink

7 8 10Pink side facing outward.Keep the pink side facing up, peel off the plastic film from the bottom side; then attach the pad to the bottom cover.
9Pink side facing outward.
  1. Peel off the transparent plastic film on the gray side of the pad, and attach this side to the top cover.
  2. After the pad is attached to the top cover, remove the other plastic film from the pad.
Memory module slot 1
  • 2 Top cover side
  • 11 System board side
Pink side facing outward.

  • Top / Bottom cover side:

    • Keep the pink side facing up, peel off the plastic film from the bottom side; then attach the pad to the top /bottom cover.

  • System board side:

    1. Keep the pink side of the thermal pad facing up. Peel off the plastic film from the bottom side; align the thermal pad to the marking on the system board; then, stick the thermal pad to the system board.

    2. Remove the liner from the adhesive on the back of the ESD absorbent pad, align the ESD absorbent pad with the thermal pad; then, stick the ESD absorbent pad to the thermal pad.

Memory module slot 2
  • 10 Bottom cover side
  • 14 System board side
M.2 drive slot 1
  • 8 Bottom cover side
  • 13 System board side
Pink side facing outward.Keep the pink side facing up, peel off the plastic film from the bottom side; then attach the pad to the cover / system board.
M.2 drive slot 2 & 3
  • 3 Top cover side
  • 12 System board side