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Technical specifications

Summary of the technical specifications of server. Depending on the model, some features might not be available, or some specifications might not apply.

Processor
One multi-core Intel Xeon D-2700 processor in Ball-Grid Array (BGA) package:
  • Scalable up to 16 cores
  • Supports TDP up to 100W

For a list of supported processors, see: Lenovo Data Center Support.

Memory

See Memory module installation rules and order for detailed information about memory configuration and setup.

  • Slots: 4 dual inline memory module (DIMM) connectors
  • Memory module types:
    • Double-data-rate 4 (TruDDR4) error correcting code (ECC) 3200 MHz registered DIMM (RDIMM)
      Note
      Memory operates at up to 2933 MHz, depending on the processor selected.
  • Capacity:
    • 16 GB (2Rx8)
    • 32 GB (2Rx4, 2Rx8)
    • 64 GB (2Rx4)
  • Total capacity
    • Minimum: 16 GB
    • Maximum: 256 GB

For a list of supported memory modules, see: Lenovo ServerProven website.

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M.2 Drive
M.2 boot drives
  • Up to two 80 mm (2280) NVMe M.2 boot drives
M.2 storage drives
  • Up to eight NVMe M.2 storage drives of the following drive form factors:
    • 80 mm (2280)
    • 110 mm (22110)

For a list of supported M.2 drives, see: Lenovo ServerProven website.

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Storage expansion

Supported storage expansion varies by model.

  • M.2 storage drives
    • Up to eight NVMe M.2 storage drives of the following drive form factors:
      • 80 mm (2280)
      • 110 mm (22110)
  • Hot-swap drives
    • Up to two 7mm SATA/NVMe hot-swap drives

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Expansion slots

Supported expansion slots vary by model.

  • Slot 1 to 2 (I/O module board): NVMe Gen3 x1 M.2 boot drives
  • Slot 3 (Left wing of riser assembly) supports one of the following:
    • One PCIe Gen4 x16 FH/HL adapter
    • One PCIe Gen4 x16 HH/HL adapter
    • One NVMe Gen4 x4 M.2 storage drive
  • Slot 4 to 6 (Left wing of riser assembly): NVMe Gen4 x4 M.2 storage drives
  • Slot 7 (Right wing of riser assembly) supports one of the following:
    • One PCIe Gen4 x16 HH/HL adapter
    • One NVMe Gen4 x4 M.2 storage drive
  • Slot 8 to 10 (Right wing of riser assembly): NVMe Gen4 x4 M.2 storage drives
  • Slot 11 to 12 (Bottom M.2 cabled adapter): NVMe Gen3 x4 M.2 storage drives
    Note

    When Slot 3 to 6 support M.2 storage drives, Slot 11 to 12 are disabled.

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Graphics processing unit (GPU)

Supports up to two low-profile PCIe GPU adapters

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Integrated functions and I/O connectors
  • Lenovo XClarity Controller (XCC), which provides service processor control and monitoring functions, video controller, and remote keyboard, video, mouse, and remote drive capabilities.
  • Front I/O connectors
    Note

    The slot for Bluetooth antenna is on the front of the server. For the models without wireless module, install the Bluetooth antenna filler to the corresponding slot for proper operation. The Bluetooth antenna filler is in the material box. See Front view to locate the Bluetooth antenna filler.

    • One XCC system management port on the front to connect to a systems-management network. This RJ-45 connector is dedicated to the Lenovo XClarity Controller functions and runs at 1 GB speed.
    • Two USB 3.2 Gen 1 (5 Gbps) Type-A connectors
    • One USB 3.2 Gen 1 (5 Gbps) Type-C connector with display support
    • One USB 2.0 Type-C connector with Lenovo XClarity Controller management
    • Two 2.5GbE RJ-45 connectors
    • Depending on the model, one of the following groups of Ethernet connectors:
      • With 10/25GbE I/O module board installed: four 10/25GbE SFP28 connectors
        Note
        The transmission speed of SFP28 connectors could be 10 Gbps or 25 Gbps, depending on the processor selected. Processors with at least 16 cores support transmission speed of 25 Gbps.
      • With 1GbE I/O module board installed: four 1GbE RJ-45 connectors

  • Rear I/O connector

    • One RJ-45 RS-232 serial console connector

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Network

Ethernet connectors

  • Two 2.5GbE RJ-45 connectors
  • Depending on the model, one of the following groups of Ethernet connectors:
    • With 10/25GbE I/O module board installed: four 10/25GbE SFP28 connectors
      Note
      The transmission speed of SFP28 connectors could be 10 Gbps or 25 Gbps, depending on the processor selected. Processors with at least 16 cores support transmission speed of 25 Gbps.
    • With 1GbE I/O module board installed: four 1GbE RJ-45 connectors

Ethernet adapters

  • Up to two low-profile PCIe Ethernet adapters

Wireless module

The models with wireless module support the following:

  • One x86 WLAN module (Intel AX210)

    • With the x86 WLAN feature, SE360 V2 is able to connect to wireless network. The WLAN connection established by x86 WLAN can serve as the main or backup network connection of the system. The x86 WLAN connection and the wired network connection can be failover to each other.

    Note

    • The x86 WLAN module (Intel AX210) officially supports Microsoft Windows Server operating system.

    • Some non-Windows operating systems with corresponding inbox driver might be able to support the x86 WLAN module (Intel AX210). For a list of operating systems supporting Intel AX210, see ThinkEdge SE360 V2 Product Guide on Lenovo Press website.

  • One XCC WLAN and Bluetooth module

    • With XCC WLAN feature, SE360 V2 supports remote management with WLAN connection. Before connecting XCC to WLAN, set the network connection for XCC to access and enable XCC WLAN feature. See XCC WLAN configuration for more information.

    • Suppporting Bluetooth 5.3

    • Bluetooth connection to the system can be established with ThinkShield Edge Mobile Management App, and be used to complete Mobile App activation procedure. See Activate or unlock the system for more information.

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Storage controller

Software RAID

  • Intel VROC SATA RAID: supports RAID level 0, 1
  • Intel VROC NVMe RAID
    • VROC Standard: supports RAID level 0, 1, 10 and requires an activation key.
    • VROC Premium: supports RAID level 0, 1, 5, 10 and requires an activation key.
  • With Intel VROC, SE360 V2 supports the following RAID configurations:
    • M.2 boot drives: NVMe RAID (RAID level 0, 1)
    • Storage drives:
      • SATA RAID (RAID level 0, 1) for 7mm SATA storage drives
      • NVMe RAID (RAID level 0, 1, 5, 10) for 7mm NVMe storage drives and M.2 NVMe storage drives
Note

  • Mixing storage drives and boot drives in one RAID array is not supported.

  • The storage drives in the following groups are supported to configure in one RAID array with drives of the same group. Drives in different groups cannot be in the same RAID array.

    • M.2 storage drives on the left wing of riser assembly (Slot 3 to 6)

    • M.2 storage drives on the right wing of riser assembly (Slot 7 to 10)

    • 7mm storage drives (Bay 0, 1) and M.2 storage drives on the bottom M.2 cabled adapter (Slot 11, 12)

  • For more information about RAID configuration, see RAID configuration.

  • For more information about acquiring and installing the activation key, see Lenovo Features on Demand website.

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System fan

  • Two 80 mm x 80 mm x 56 mm dual-rotor fans, supporting one of the following air flow directions:

    • Front-to-rear air flow direction
    • Rear-to-front air flow direction (supporting dust filter measurement feature)
      Note

      • With air flow sensor board installed, SE360 V2 BMC supports dust filter measurement feature to check the status of the rear dust filter. See Set dust filter measurement for more information.

      • Specific mounting options of SE360 V2 require specific fan air flow direction. See Configuration guide for more information.

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Electrical input
The models with DC/DC power module board (Output 12V): one of the following
Note

If applicable, before connecting DC power source to the server, remove the header from the corresponding power connector. See Rear view to locate the power connector and remove the header.

  • Dual 12-48V variable DC power source input
  • Up to two 300W (230V/115V) external power adapters
    Note
    When one or two 300W external power adapters are installed, keep ambient temperature lower than 40°C, and the following configuration is required:
    • 8 core processor
    • Four memory modules
    • Up to one ThinkSystem NVIDIA A2 16GB PCIe Gen4 Passive GPU
    • Up to two 7mm SATA drives
    • Up to two M.2 NVMe boot drives installed on 1GbE I/O module board
    • Desktop mount is supported
The models with internal power supply (AC power module board):
  • Single 500W (230V/115V) AC power source input

Supported external power adapters:

As required by COMMISSION REGULATION (EU) 2019/1782 of 1 October 2019 laying down ecodesign requirements for external power supplies pursuant to Directive 2009/125/EC of the European Parliament and of the Council and repealing Commission Regulation (EC) No 278/2009 (ErP Lot7) for the external power supply of the product.
ThinkEdge 300W 230V/115V External Power Supply

Information published

Value and precision

Unit

Manufacturer’s name

Lenovo

-

Model identifier

ADL300SDC3A

-

Input voltage

100-240

V

Input AC frequency

50-60

Hz

Output voltage

20.0

V

Output current

15.0

A

Output power

300.0

W

Average active efficiency

90.00

%

Efficiency at low load (10 %)

88.07

%

No-load power consumption

0.15

W

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Minimal configuration for debugging

  • One DRAM memory module in DIMM slot 1

  • Depending on the model, one of the following power source:
    • One 300W external power adapter
    • AC power source input
    • DC power source input

  • One 2280 NVMe M.2 drive in Slot 1 on the I/O module board

  • Two system fans

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Operating systems
Supported and certified operating systems:

  • Microsoft Windows Server

  • VMware ESXi

  • Red Hat Enterprise Linux

  • SUSE Linux Enterprise Server

Note

  • The x86 WLAN module (Intel AX210) officially supports Microsoft Windows Server operating system.

  • Some non-Windows operating systems with corresponding inbox driver might be able to support the x86 WLAN module (Intel AX210). For a list of operating systems supporting Intel AX210, see ThinkEdge SE360 V2 Product Guide on Lenovo Press website.

References:

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