Thermal rules
This topic provides thermal rules for the server.
Group B: 200 W ≤ cTDP ≤ 240 W
Group A: 240 W < cTDP ≤ 300 W
Group E: 320 W ≤ cTDP ≤ 400 W
Typical configurations
This section provides thermal information for typical configurations.
Front bays | Max. Temp. | Processor | Heat sink | Air baffle | Fan type | Support 3DS RDIMMs |
---|---|---|---|---|---|---|
| 45°C | Group B | 2U P | S | P | N |
35°C | Group B | 2U S | S | S | N | |
Group B | 2U S | S | P | Y | ||
Group A | 2U P | S | P | Y | ||
30°C | Group B | 2U S | S | P | Y | |
Group A | 2U P | S | P | Y | ||
25°C | Group E | 2U P | S | P | Y |
When a part with active optical cable (AOC) is installed and the rate of the part is greater than 25 GB, the ambient temperature must be limited to 30°C or lower.
When the following parts are installed, the ambient temperature must be limited to 35°C or lower.
Broadcom 57416 10GBASE-T 2-port OCP
Broadcom 57454 10GBASE-T 4-port OCP
PCIe network interface cards (NICs) at a rate greater than or equal to 100 GB
Parts with AOC and at the rate of 25 GB
Storage configurations
This section provides thermal information for storage configurations.
Front bays | Middle bays | Rear bays | Max. Temp. | Processor | Heat sink | Air baffle | Fan type | Support 3DS RDIMMs |
---|---|---|---|---|---|---|---|---|
24 x 2.5" | NA | NA | 30°C | Group B | 2U S | S | S | N |
NA | NA | 30°C | Group B | 2U S | S | P | Y | |
NA | NA | 30°C | Group A | 2U P | S | P | Y | |
NA |
| 30°C | Group B | 2U P | S | P | Y | |
| NA | 30°C | Group B | 2U P | NA | P | Y | |
8 x 2.5" S/S |
| 30°C | Group B | 2U P | NA | P | Y | |
12 x 3.5" | NA | NA | 30°C | Group B | 2U S | S | P | Y |
NA | NA | 30°C | Group A | 2U P | S | P | Y | |
NA |
| 30°C | Group B | 2U P | S | P | Y | |
8 x 2.5" Any | NA | 30°C | Group B | 2U P | NA | P | Y | |
4 x 3.5" |
| 30°C | Group B | 2U P | NA | P | Y |
- A part with AOC and at a rate greater than 25 GB is supported under the following conditions:
Performance fans are used.
The part is not installed on slot 3.
The following parts are not supported in storage configurations:
Broadcom 57416 10GBASE-T 2-port OCP
Broadcom 57454 10GBASE-T 4-port OCP
GPU configurations
This section provides thermal information for the GPU configuration.
Half-height half-length (HHHL) single-wide (SW) GPU: A2
HHHL double-wide (DW) GPU: A2000
Full-height full-length (FHFL) DW GPU: A30, A4500, A16, A40, A100, A6000, H100, AMD MI210
Front bays | Max. Temp. | Processor | Heat sink | Air baffle | Fan type | Max. GPU Qty. | ||||
---|---|---|---|---|---|---|---|---|---|---|
SW | DW (A2000) | DW (A40) | DW (H100) | Other DW | ||||||
8 x 2.5" | 30°C | Group B | 2U S | S | P | 8 | 3 | NA | NA | NA |
Group A | 2U P | S | P | 8 | 3 | NA | NA | NA | ||
Group B, A | 2U P | GPU | P | NA | NA | 2 (slot 2/5) | 3 | 3 | ||
16 x 2.5" | 30°C | Group B | 2U S | S | P | 8 | 3 | NA | NA | NA |
Group A | 2U P | S | P | 8 | 3 | NA | NA | NA | ||
Group B, A | 2U P | GPU | P | NA | NA | 2 (slot 2/5) | 2 (slot 2/5) | 3 | ||
8 x 3.5" | 30°C | Group B | 2U S | S | P | 8 | 3 | NA | NA | NA |
Group A | 2U P | S | P | 8 | 3 | NA | NA | NA | ||
Group B, A | 2U P | GPU | P | NA | NA | 3 | 3 | 3 | ||
24 x 2.5" | 25°C | Group B | 2U S | S | P | 6 | 3 | NA | NA | NA |
Group A | 2U P | S | P | 6 | 3 | NA | NA | NA | ||
Group B, A | 2U P | GPU | P | NA | NA | NA | 2 (slot 2/5) | 2 (slot 2/5) |
For 24 x 2.5" configurations with GPUs, a part with AOC and at a rate greater than 25 GB is not supported on slot 3.
The following parts are not supported in 24 x 2.5" configurations with GPUs:
Broadcom 57416 10GBASE-T 2-port OCP
Broadcom 57454 10GBASE-T 4-port OCP