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Thermal rules

This topic provides thermal rules for the server.

Processor groups are defined as follows:
  • Group B: 200 W ≤ cTDP ≤ 240 W

  • Group A: 240 W < cTDP ≤ 300 W

  • Group E: 320 W ≤ cTDP ≤ 400 W

Typical configurations

This section provides thermal information for typical configurations.

Max. Temp.: Maximum ambient temperature at sea level; S: standard; P: performance; Y: yes; N: no
Front baysMax. Temp.ProcessorHeat sinkAir baffleFan typeSupport 3DS RDIMMs
  • 8 x 2.5"

  • 16 x 2.5"

  • 8 x 3.5"

45°CGroup B2U PSPN
35°CGroup B2U SSSN
Group B2U SSPY
Group A2U PSPY
30°CGroup B2U SSPY
Group A2U PSPY
25°CGroup E2U PSPY
Note
  • When a part with active optical cable (AOC) is installed and the rate of the part is greater than 25 GB, the ambient temperature must be limited to 30°C or lower.

  • When the following parts are installed, the ambient temperature must be limited to 35°C or lower.

    • Broadcom 57416 10GBASE-T 2-port OCP

    • Broadcom 57454 10GBASE-T 4-port OCP

    • PCIe network interface cards (NICs) at a rate greater than or equal to 100 GB

    • Parts with AOC and at the rate of 25 GB

Storage configurations

This section provides thermal information for storage configurations.

Max.Temp.: Maximum ambient temperature at sea level; S/S: SAS/SATA; Any: AnyBay; S: standard; P: performance; NA: none; Y: yes; N: no
Front baysMiddle baysRear baysMax. Temp.ProcessorHeat sinkAir baffleFan typeSupport 3DS RDIMMs

24 x 2.5"

NANA30°CGroup B2U SSSN
NANA30°CGroup B2U SSPY
NANA30°CGroup A2U PSPY
NA
  • 4 x 2.5" S/S

  • 4 x 2.5" Any

  • 8 x 2.5" S/S

30°CGroup B2U PSPY
  • 4 x 2.5" S/S

  • 8 x 2.5" S/S

  • 8 x 2.5" NVMe

NA30°CGroup B2U PNAPY

8 x 2.5" S/S

  • 4 x 2.5" S/S

  • 8 x 2.5" S/S

30°CGroup B2U PNAPY

12 x 3.5"

NANA30°CGroup B2U SSPY
NANA30°CGroup A2U PSPY
NA
  • 4 x 2.5"

  • 2 x 3.5"

  • 4 x 3.5"

30°CGroup B2U PSPY

8 x 2.5" Any

NA30°CGroup B2U PNAPY

4 x 3.5"

  • 4 x 2.5"

  • 4 x 3.5"

30°CGroup B2U PNAPY
Note
  • A part with AOC and at a rate greater than 25 GB is supported under the following conditions:
    • Performance fans are used.

    • The part is not installed on slot 3.

  • The following parts are not supported in storage configurations:

    • Broadcom 57416 10GBASE-T 2-port OCP

    • Broadcom 57454 10GBASE-T 4-port OCP

GPU configurations

This section provides thermal information for the GPU configuration.

  • Half-height half-length (HHHL) single-wide (SW) GPU: A2

  • HHHL double-wide (DW) GPU: A2000

  • Full-height full-length (FHFL) DW GPU: A30, A4500, A16, A40, A100, A6000, H100, AMD MI210

Max.Temp.: Maximum ambient temperature at sea level; SW: single-wide; DW: double-wide; S: standard; P: performance
Front baysMax. Temp.ProcessorHeat sinkAir baffleFan typeMax. GPU Qty.
SWDW (A2000)DW (A40)DW (H100)Other DW

8 x 2.5"

30°CGroup B2U SSP83NANANA
Group A2U PSP83NANANA
Group B, A2U PGPUPNANA2 (slot 2/5)33

16 x 2.5"

30°CGroup B2U SSP83NANANA
Group A2U PSP83NANANA
Group B, A2U PGPUPNANA2 (slot 2/5)2 (slot 2/5)3

8 x 3.5"

30°CGroup B2U SSP83NANANA
Group A2U PSP83NANANA
Group B, A2U PGPUPNANA333

24 x 2.5"

25°CGroup B2U SSP63NANANA
Group A2U PSP63NANANA
Group B, A2U PGPUPNANANA2 (slot 2/5)2 (slot 2/5)
Note
  • For 24 x 2.5" configurations with GPUs, a part with AOC and at a rate greater than 25 GB is not supported on slot 3.

  • The following parts are not supported in 24 x 2.5" configurations with GPUs:

    • Broadcom 57416 10GBASE-T 2-port OCP

    • Broadcom 57454 10GBASE-T 4-port OCP