Thermal rules

This topic provides thermal rules for the server.

• Typical configurations

• Storage configurations

• GPU configuration

Processor groups are defined as follows:

• Group B: 200 W ≤ cTDP ≤ 240 W

• Group A: 240 W < cTDP ≤ 300 W

• Group E: 320 W ≤ cTDP ≤ 400 W

Typical configurations

This section provides thermal information for typical configurations.

Max. Temp.: Maximum ambient temperature at sea level; S: standard; P: performance; Y: yes; N: no

Front bays	Max. Temp.	Processor	Heat sink	Air baffle	Fan type	Support 3DS RDIMMs
8 x 2.5" 16 x 2.5" 8 x 3.5"	45°C	Group B	2U P	S	P	N
	35°C	Group B	2U S	S	S	N
		Group B	2U S	S	P	Y
		Group A	2U P	S	P	Y
	30°C	Group B	2U S	S	P	Y
		Group A	2U P	S	P	Y
	25°C	Group E	2U P	S	P	Y

Note

• When a part with active optical cable (AOC) is installed and the rate of the part is greater than 25 GB, the ambient temperature must be limited to 30°C or lower.

• When the following parts are installed, the ambient temperature must be limited to 35°C or lower.

  • Broadcom 57416 10GBASE-T 2-port OCP

  • Broadcom 57454 10GBASE-T 4-port OCP

  • PCIe network interface cards (NICs) at a rate greater than or equal to 100 GB

  • Parts with AOC and at the rate of 25 GB

Storage configurations

This section provides thermal information for storage configurations.

Max.Temp.: Maximum ambient temperature at sea level; S/S: SAS/SATA; Any: AnyBay; S: standard; P: performance; NA: none; Y: yes; N: no

Front bays	Middle bays	Rear bays	Max. Temp.	Processor	Heat sink	Air baffle	Fan type	Support 3DS RDIMMs
24 x 2.5"	NA	NA	30°C	Group B	2U S	S	S	N
	NA	NA	30°C	Group B	2U S	S	P	Y
	NA	NA	30°C	Group A	2U P	S	P	Y
	NA	4 x 2.5" S/S 4 x 2.5" Any 8 x 2.5" S/S	30°C	Group B	2U P	S	P	Y
	4 x 2.5" S/S 8 x 2.5" S/S 8 x 2.5" NVMe	NA	30°C	Group B	2U P	NA	P	Y
	8 x 2.5" S/S	4 x 2.5" S/S 8 x 2.5" S/S	30°C	Group B	2U P	NA	P	Y
12 x 3.5"	NA	NA	30°C	Group B	2U S	S	P	Y
	NA	NA	30°C	Group A	2U P	S	P	Y
	NA	4 x 2.5" 2 x 3.5" 4 x 3.5"	30°C	Group B	2U P	S	P	Y
	8 x 2.5" Any	NA	30°C	Group B	2U P	NA	P	Y
	4 x 3.5"	4 x 2.5" 4 x 3.5"	30°C	Group B	2U P	NA	P	Y

Note

• A part with AOC and at a rate greater than 25 GB is supported under the following conditions:

  • Performance fans are used.

  • The part is not installed on slot 3.

• The following parts are not supported in storage configurations:

  • Broadcom 57416 10GBASE-T 2-port OCP

  • Broadcom 57454 10GBASE-T 4-port OCP

GPU configurations

This section provides thermal information for the GPU configuration.

• Half-height half-length (HHHL) single-wide (SW) GPU: A2

• HHHL double-wide (DW) GPU: A2000

• Full-height full-length (FHFL) DW GPU: A30, A4500, A16, A40, A100, A6000, H100, AMD MI210

Max.Temp.: Maximum ambient temperature at sea level; SW: single-wide; DW: double-wide; S: standard; P: performance

Front bays	Max. Temp.	Processor	Heat sink	Air baffle	Fan type	Max. GPU Qty.
						SW	DW (A2000)	DW (A40)	DW (H100)	Other DW
8 x 2.5"	30°C	Group B	2U S	S	P	8	3	NA	NA	NA
		Group A	2U P	S	P	8	3	NA	NA	NA
		Group B, A	2U P	GPU	P	NA	NA	2 (slot 2/5)	3	3
16 x 2.5"	30°C	Group B	2U S	S	P	8	3	NA	NA	NA
		Group A	2U P	S	P	8	3	NA	NA	NA
		Group B, A	2U P	GPU	P	NA	NA	2 (slot 2/5)	2 (slot 2/5)	3
8 x 3.5"	30°C	Group B	2U S	S	P	8	3	NA	NA	NA
		Group A	2U P	S	P	8	3	NA	NA	NA
		Group B, A	2U P	GPU	P	NA	NA	3	3	3
24 x 2.5"	25°C	Group B	2U S	S	P	6	3	NA	NA	NA
		Group A	2U P	S	P	6	3	NA	NA	NA
		Group B, A	2U P	GPU	P	NA	NA	NA	2 (slot 2/5)	2 (slot 2/5)

Note

• For 24 x 2.5" configurations with GPUs, a part with AOC and at a rate greater than 25 GB is not supported on slot 3.

• The following parts are not supported in 24 x 2.5" configurations with GPUs:

  • Broadcom 57416 10GBASE-T 2-port OCP

  • Broadcom 57454 10GBASE-T 4-port OCP