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Thermal rules for server with 9005 series processors

This topic provides thermal rules for the server with 9005 series processors.

Abbreviations used in tables below are defined as follows:

  • Max.Temp.: Maximum ambient temperature at sea level

  • DWCM: Direct Water Cooling Module

  • FIO = riser 5 + front OCP

  • S/S: SAS/SATA

  • Any: AnyBay

  • S: standard

  • P: performance

  • A: advanced

  • NA: not applicable

  • Y: yes

  • Y* in the Support middle bays or Support rear bays column: yes (when no Gen5 7.68 TB or larger capacity NVMe drive or no Gen4 P5336 15.36 TB/30.72 TB/61.44 TB NVMe drive is installed)

  • N: no

Processor groups are defined as follows:

  • Group D: 9015, 9115

  • Group B: 9135, 9335, 9255

  • Group A: 9355(P), 9535, 9365, 9455(P)

  • Group E1: 9555(P), 9565, 9645, 9655(P), 9745, 9825, 9845

  • Group E2: 9375F, 9475F, 9575F

  • Group E3: 9175F, 9275F

Note
  • ThinkSystem NVIDIA BlueField-3 VPI QSFP112 2P 200G PCIe Gen5 x16 is supported under the following conditions:

    • The ambient temperature is 25°C or lower.

    • The processor TDP is less than or equal to 300 W.

    • The GPU air baffle and performance fans are used.

    • The server is not equipped with 24 x 2.5", 16 x 2.5" + FIO, or 12 x 3.5" front drive bays.

  • Performance fans are needed for all GPU configurations.

  • The GPU air baffle is needed in configurations that include adapters with power greater than 75 W. No air baffle is needed in configurations with middle drive bays.

  • The support for H100 NVL GPU adapter is subject to the following limitations:

    • The 24 x 2.5" and 16 x 2.5" + FIO GPU configurations do not support the H100 NVL GPU adapter.

    • In GPU configurations without DWCM, the H100 NVL GPU adapter is supported under the following conditions:

      • The processor TDP is less than or equal to 300 W.

      • The ambient temperature is 25°C or lower.

    • In GPU configurations with DWCM, the H100 NVL GPU adapter is supported at a maximum temperature of 30°C.

Standard configurations​

This section provides thermal information for standard configurations.
Note

When a part with active optical cable (AOC) is installed and the rate of the part is greater than 25 GB, the ambient temperature must be limited to 30°C or lower.

Front baysMax. Temp.ProcessorHeat sinkFan typeSupport 64/96/128 GB DIMMSupport 256 GB DIMM

8 x 2.5"

16 x 2.5"

8 x 3.5"

FIO

8 x2.5"+FIO

35°CAll supportedDWCMSNN
All supportedDWCMPYY
Group D, B2U SSNN
Group D, B, A2U SPYY
Group E12U APYN
30°CAll supportedDWCMSYY
Group E12U PPYN
Group E2, E32U APYN
25°CGroup E1, E22U PPYY
Group E32U APYY

Storage configurations without DWCM​

This section provides thermal information for storage configurations without DWCM.
Note
  • In storage configurations without DWCM, a part with AOC and at a rate greater than 25 GB is supported under the following conditions:

    • Performance fans are used.

    • The part is not installed on slot 3.

    • The ambient temperature is 30°C or lower.

  • The following parts are not supported in storage configurations without DWCM:

    • Broadcom 57416 10GBASE-T 2-port OCP

    • Broadcom 57454 10GBASE-T 4-port OCP

Front baysSupport middle baysSupport rear baysMax. Temp.ProcessorHeat sinkFan typeSupport 64/96/128 GB DIMMSupport 256 GB DIMM

24 x 2.5"

16 x 2.5" + FIO

NN30°CGroup D, B2U SSNN
NN30°CGroup D, B2U SPYY
NN30°CGroup A2U PPNN
NN30°CGroup E1, E22U APNN
NY*30°CGroup D, B2U PPNN
Y*N/Y*30°CGroup D, B2U PPNN
NN25°CGroup D, B2U SPYY
NN25°CGroup A, E12U PPYN
NN25°CGroup E2, E32U APYN
NY25°CGroup D, B, A2U PPYN
YN/Y25°CGroup D, B, A2U PPYN

12 x 3.5"

NN30°CGroup D, B2U SPYN
NN30°CGroup A2U PPNN
NN30°CGroup E1, E22U APNN
NY*30°CGroup D, B2U PPNN
Y*N/Y*30°CGroup D, B2U PPNN
NN25°CGroup E12U PPNN
NN25°CGroup E22U APNN
NY25°CGroup D, B, A2U PPNN
YN/Y25°CGroup D, B, A2U PPNN

Storage configurations with DWCM​

This section provides thermal information for storage configurations with DWCM.
Note

  • In storage configurations with DWCM, the ambient temperature is limited to 30°C or lower when a part with AOC and at a rate greater than 25 GB is installed.

  • In storage configurations with DWCM and middle or rear bays, the ambient temperature is limited to 30°C or lower when Gen5 7.68 TB or larger capacity NVMe drives or Gen4 P5336 15.36 TB, 30.72, or 61.44 TB NVMe drives are installed.

Front baysSupport middle baysSupport rear baysMax. Temp.Fan typeSupport ≥ 64 GB DIMM

24 x 2.5"

16 x 2.5" + FIO

12 x 3.5"

NN35°CSN
NN30°CSY
NN/Y35°CPY
YN/Y35°CPY

GPU configurations without DWCM​

This section provides thermal information for GPU configurations without DWCM.

  • Half-height half-length (HHHL) single-wide (SW) GPU: A2, L4

  • HHHL double-wide (DW) GPU: A2000

  • Full-height full-length (FHFL) DW GPU: A30, A4500, A16, A40, A100, A6000, L40, L40S, H100, RTX 6000 Ada, RTX 4500 Ada, H100 NVL, AMD MI210

Note
  • In GPU configurations with 24 x 2.5" or 16 x 2.5" + FIO front bays or GPU configurations with Group E1 processors, a part with AOC and at a rate greater than 25 GB cannot be installed on slot 3, and the following parts are not supported:

    • Broadcom 57416 10GBASE-T 2-port OCP

    • Broadcom 57454 10GBASE-T 4-port OCP

  • The 6400 MHz 256 GB DIMM is supported in the following GPU configurations without DWCM:

    • configurations with 8 x 2.5"/FIO/8 x 2.5" + FIO/16 x 2.5"/8 x 3.5" front bays, performance heat sinks, and standard air baffle (at a maximum temperature of 25°C)

    • configurations with standard heat sinks

Front baysMax. Temp.ProcessorHeat sinkAir baffleMax. GPU Qty.
A2/L4A2000A40/L40350W DWOther DW

8 x 2.5"

8 x 3.5"

FIO

30°CGroup D, B2U SS103NANANA
Group A2U PS103NANANA
Group D, B, A2U PGPUNANA333
25°CGroup E12U PS63NANANA
Group E12U PGPUNANA2 (slot 2/5)2 (slot 2/5)2 (slot 2/5)

16 x 2.5"

8 x 2.5" + FIO

30°CGroup D, B2U SS103NANANA
Group A2U PS103NANANA
Group D, B, A2U PGPUNANA2 (slot 2/5)2 (slot 2/5)3
25°CGroup E12U PS63NANANA
Group E12U PGPUNANA2 (slot 2/5)2 (slot 2/5)2 (slot 2/5)

24 x 2.5"

16 x 2.5" + FIO

25°CGroup D, B2U SS63NANANA
Group A2U PS63NANANA
Group D, B, A2U PGPUNANA2 (slot 2/5)2 (slot 2/5)2 (slot 2/5)

GPU configurations with DWCM​

This section provides thermal information for GPU configurations with DWCM.

  • Half-height half-length (HHHL) single-wide (SW) GPU: A2, L4

  • HHHL double-wide (DW) GPU: A2000

  • Full-height full-length (FHFL) DW GPU: A30, A4500, A16, A40, A100, A6000, L40, L40S, H100, RTX 6000 Ada, RTX 4500 Ada, H100 NVL, AMD MI210

Note

  • When a part with active optical cable (AOC) is installed and the rate of the part is greater than 25 GB, the ambient temperature must be limited to 30°C or lower.

  • In GPU configurations with 8 x 2.5"/FIO/8 x 2.5" + FIO/16 x 2.5"/8 x 3.5" front bays, DWCM, and GPU air baffle, 6400 MHz 64/96/128 GB DIMMs are supported at a maximum temperature of 30°C.

  • In GPU configurations with 24 x 2.5"/16 x 2.5" + FIO front bays, DWCM, and GPU air baffle, 6400 MHz 64/96/128 GB DIMMs are supported at a maximum temperature of 25°C.

  • The 6400 MHz 256 GB DIMM is supported in the following GPU configurations with DWCM:

    • configurations with 8 x 2.5"/FIO/8 x 2.5" + FIO/16 x 2.5"/8 x 3.5" front bays and GPU air baffle (at a maximum temperature of 25°C)

    • configurations with 24 x 2.5"/16 x 2.5" + FIO front bays and standard air baffle (at a maximum temperature of 25°C)

  • Servers with 8 x 2.5" + FIO/16 x 2.5"/8 x 3.5" front bays support up to three A40/A100/L40/MI210/H100/L40S GPU adapters at a maximum temperature of 30°C.

  • Servers with 24 x 2.5"/16 x 2.5" + FIO front bays support up to three H100/L40S GPU adapters at a maximum temperature of 30°C and three A40/L40 GPU adapters at a maximum temperature of 25°C.

Front baysMax. Temp.ProcessorAir baffleMax. GPU Qty.
HHHLFHFL

  • 8 x 2.5"

  • FIO

  • 8 x 3.5"

  • 16 x 2.5"

  • 8 x 2.5" + FIO

  • 24 x 2.5"

  • 16 x 2.5" + FIO

35°CAll supportedS8NA
GPUNA3