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Thermal rules for server with 9005 series processors

This topic provides thermal rules for the server with 9005 series processors.

Abbreviations used in tables below are defined as follows:

  • Max.Temp.: Maximum ambient temperature at sea level

  • DWCM: Direct Water Cooling Module

  • FIO = riser 5 + front OCP

  • S/S: SAS/SATA

  • Any: AnyBay

  • S: standard

  • P: performance

  • A: advanced

  • NA: not applicable

  • Y: yes

  • Y* in the Support middle bays or Support rear bays column: yes (when no Gen5 7.68 TB or larger capacity NVMe drive or no Gen4 P5336 15.36 TB/30.72 TB/61.44 TB NVMe drive is installed)

  • N: no

Processor groups are defined as follows:

  • Group B: 9135

  • Group A: 9355

  • Group E1: 9555, 9655

  • Group E2: 9575F

Standard configurations​

This section provides thermal information for standard configurations.

Front bays

Max. Temp.

Processor

Heat sink

Air baffle

Fan type

Support ≥ 64 GB DIMM

8 x 2.5"

16 x 2.5"

8 x 3.5"

FIO

8 x2.5"+FIO

35°C

All supported

DWCM

S

S

N

All supported

DWCM

S

P

Y

Group B

2U S

S

S

N

Group B, A

2U S

S

P

Y

Group E1

2U A

S

P

Y

30°C

All supported

DWCM

S

S

Y

Group E1

2U P

S

P

Y

Group E2

2U A

S

P

Y

25°C

Group E2

2U P

S

P

Y

Note

  • When a part with active optical cable (AOC) is installed and the rate of the part is greater than 25 GB, the ambient temperature must be limited to 30°C or lower.

  • In standard configurations with DWCM and standard fans, the ambient temperature must be limited to 30°C or lower when the following parts are installed:

    • Broadcom 57416 10GBASE-T 2-port OCP

    • Broadcom 57454 10GBASE-T 4-port OCP

Storage configurations without DWCM​

This section provides thermal information for storage configurations without DWCM.

Front bays

Support middle baysSupport rear bays

Max. Temp.

Processor

Heat sink

Air baffle

Fan type

Support ≥ 64 GB DIMM

24 x 2.5"

16 x 2.5" + FIO

N

N

30°C

Group B

2U S

S

S

N

N

N

30°C

Group B

2U S

S

P

Y

N

N

30°C

Group A

2U P

S

P

N

N

N

30°C

Group E1, E2

2U A

S

P

N

N

Y*

30°C

Group B

2U P

S

P

N

Y*

N/Y*

30°C

Group B

2U P

NA

P

N

N

N

25°C

Group A, E1

2U P

S

P

Y

N

N

25°C

Group E2

2U A

S

P

Y

N

Y

25°C

Group B, A

2U P

S

P

Y

Y

N/Y

25°C

Group B, A

2U P

NA

P

Y

12 x 3.5"

N

N

30°C

Group B

2U S

S

P

Y

N

N

30°C

Group A

2U P

S

P

N

N

N

30°C

Group E1, E2

2U A

S

P

N

N

Y*

30°C

Group B

2U P

S

P

N

Y*

N/Y*

30°C

Group B

2U P

NA

P

N

N

N

25°C

Group E1

2U P

S

P

N

N

Y

25°C

Group B, A

2U P

S

P

N

Y

N/Y

25°C

Group B, A

2U P

NA

P

N

Note

  • In storage configurations without DWCM, a part with AOC and at a rate greater than 25 GB is supported under the following conditions:

    • Performance fans are used.

    • The part is not installed on slot 3.

    • The ambient temperature is 30°C or lower.

  • The following parts are not supported in storage configurations without DWCM:

    • Broadcom 57416 10GBASE-T 2-port OCP

    • Broadcom 57454 10GBASE-T 4-port OCP

Storage configurations with DWCM​

This section provides thermal information for storage configurations with DWCM.

Front bays

Support middle baysSupport rear bays

Max. Temp.

Air baffle

Fan type

Support ≥ 64 GB DIMM

24 x 2.5"

16 x 2.5" + FIO

12 x 3.5"

N

N

35°C

S

S

N

N

N

30°C

S

S

Y

N

N/Y

35°C

S

P

Y

Y

N/Y

35°C

NA

P

Y

Note

  • In storage configurations with DWCM, the ambient temperature is limited to 30°C or lower when any of the following parts is installed:

    • a part with AOC and at a rate greater than 25 GB

    • Broadcom 57416 10GBASE-T 2-port OCP

    • Broadcom 57454 10GBASE-T 4-port OCP

  • In storage configurations with DWCM and middle or rear bays, the ambient temperature is limited to 30°C or lower when Gen5 7.68 TB or larger capacity NVMe drives or Gen4 P5336 15.36 TB, 30.72, or 61.44 TB NVMe drives are installed.

GPU configurations​

This section provides thermal information for GPU configurations.

  • Half-height half-length (HHHL) single-wide (SW) GPU: A2, L4

  • HHHL double-wide (DW) GPU: A2000

  • Full-height full-length (FHFL) DW GPU: A30, A4500, A16, A40, A100, A6000, L40, L40S, H100, RTX 6000 Ada, RTX 4500 Ada, H100 NVL, AMD MI210

Front bays

Max. Temp.

Processor

Heat sink

Air baffle

Fan type

Max. GPU Qty.

SW

DW (A2000)

DW (A40/L40)

350W DW

Other DW

8 x 2.5"

8 x 3.5"

FIO

30°C

Group B

2U S

S

P

10

3

NA

NA

NA

Group A

2U P

S

P

10

3

NA

NA

NA

Group B, A

2U P

GPU

P

NA

NA

3

3

3

25°C

Group E1

2U P

S

P

6

3

NA

NA

NA

Group E1

2U P

GPU

P

NA

NA

2 (slot 2/5)

2 (slot 2/5)

2 (slot 2/5)

16 x 2.5"

8 x 2.5" + FIO

30°C

Group B

2U S

S

P

10

3

NA

NA

NA

Group A

2U P

S

P

10

3

NA

NA

NA

Group B, A

2U P

GPU

P

NA

NA

2 (slot 2/5)

2 (slot 2/5)

3

25°C

Group E1

2U P

S

P

6

3

NA

NA

NA

Group E1

2U P

GPU

P

NA

NA

2 (slot 2/5)

2 (slot 2/5)

2 (slot 2/5)

24 x 2.5"

16 x 2.5" + FIO

25°C

Group B

2U S

S

P

6

3

NA

NA

NA

Group A

2U P

S

P

6

3

NA

NA

NA

Group B, A

2U P

GPU

P

NA

NA

2 (slot 2/5)

2 (slot 2/5)

2 (slot 2/5)

Note

In GPU configurations with 24 x 2.5" or 16 x 2.5" + FIO front bays or GPU configurations with Group E 1 processors, a part with AOC and at a rate greater than 25 GB cannot be installed on slot 3, and the following parts are not supported:

  • Broadcom 57416 10GBASE-T 2-port OCP

  • Broadcom 57454 10GBASE-T 4-port OCP