Thermal rules for server with 9005 series processors
This topic provides thermal rules for the server with 9005 series processors.
Max.Temp.: Maximum ambient temperature at sea level
DWCM: Direct Water Cooling Module
FIO = riser 5 + front OCP
S/S: SAS/SATA
Any: AnyBay
S: standard
P: performance
A: advanced
NA: not applicable
Y: yes
Y* in the Support middle bays or Support rear bays column: yes (when no Gen5 7.68 TB or larger capacity NVMe drive or no Gen4 P5336 15.36 TB/30.72 TB/61.44 TB NVMe drive is installed)
N: no
Group D: 9015, 9115
Group B: 9135, 9335, 9255
Group A: 9355(P), 9535, 9365, 9455(P)
Group E1: 9555(P), 9565, 9645, 9655(P), 9745, 9825, 9845
Group E2: 9375F, 9475F, 9575F
Group E3: 9175F, 9275F
- ThinkSystem NVIDIA BlueField-3 VPI QSFP112 2P 200G PCIe Gen5 x16 is supported under the following conditions:
The ambient temperature is 25°C or lower.
The processor TDP is less than or equal to 300 W.
The GPU air baffle and performance fans are used.
The server is not equipped with 24 x 2.5", 16 x 2.5" + FIO, or 12 x 3.5" front drive bays.
Performance fans are needed for all GPU configurations.
The GPU air baffle is needed in configurations that include adapters with power greater than 75 W. No air baffle is needed in configurations with middle drive bays.
- The support for H100 NVL GPU adapter is subject to the following limitations:
The 24 x 2.5" and 16 x 2.5" + FIO GPU configurations do not support the H100 NVL GPU adapter.
- In GPU configurations without DWCM, the H100 NVL GPU adapter is supported under the following conditions:
The processor TDP is less than or equal to 300 W.
The ambient temperature is 25°C or lower.
In GPU configurations with DWCM, the H100 NVL GPU adapter is supported at a maximum temperature of 30°C.
Standard configurations
When a part with active optical cable (AOC) is installed and the rate of the part is greater than 25 GB, the ambient temperature must be limited to 30°C or lower.
Front bays | Max. Temp. | Processor | Heat sink | Fan type | Support 64/96/128 GB DIMM | Support 256 GB DIMM |
---|---|---|---|---|---|---|
8 x 2.5" 16 x 2.5" 8 x 3.5" FIO 8 x2.5"+FIO | 35°C | All supported | DWCM | S | N | N |
All supported | DWCM | P | Y | Y | ||
Group D, B | 2U S | S | N | N | ||
Group D, B, A | 2U S | P | Y | Y | ||
Group E1 | 2U A | P | Y | N | ||
30°C | All supported | DWCM | S | Y | Y | |
Group E1 | 2U P | P | Y | N | ||
Group E2, E3 | 2U A | P | Y | N | ||
25°C | Group E1, E2 | 2U P | P | Y | Y | |
Group E3 | 2U A | P | Y | Y |
Storage configurations without DWCM
- In storage configurations without DWCM, a part with AOC and at a rate greater than 25 GB is supported under the following conditions:
Performance fans are used.
The part is not installed on slot 3.
The ambient temperature is 30°C or lower.
The following parts are not supported in storage configurations without DWCM:
Broadcom 57416 10GBASE-T 2-port OCP
Broadcom 57454 10GBASE-T 4-port OCP
Front bays | Support middle bays | Support rear bays | Max. Temp. | Processor | Heat sink | Fan type | Support 64/96/128 GB DIMM | Support 256 GB DIMM |
---|---|---|---|---|---|---|---|---|
24 x 2.5" 16 x 2.5" + FIO | N | N | 30°C | Group D, B | 2U S | S | N | N |
N | N | 30°C | Group D, B | 2U S | P | Y | Y | |
N | N | 30°C | Group A | 2U P | P | N | N | |
N | N | 30°C | Group E1, E2 | 2U A | P | N | N | |
N | Y* | 30°C | Group D, B | 2U P | P | N | N | |
Y* | N/Y* | 30°C | Group D, B | 2U P | P | N | N | |
N | N | 25°C | Group D, B | 2U S | P | Y | Y | |
N | N | 25°C | Group A, E1 | 2U P | P | Y | N | |
N | N | 25°C | Group E2, E3 | 2U A | P | Y | N | |
N | Y | 25°C | Group D, B, A | 2U P | P | Y | N | |
Y | N/Y | 25°C | Group D, B, A | 2U P | P | Y | N | |
12 x 3.5" | N | N | 30°C | Group D, B | 2U S | P | Y | N |
N | N | 30°C | Group A | 2U P | P | N | N | |
N | N | 30°C | Group E1, E2 | 2U A | P | N | N | |
N | Y* | 30°C | Group D, B | 2U P | P | N | N | |
Y* | N/Y* | 30°C | Group D, B | 2U P | P | N | N | |
N | N | 25°C | Group E1 | 2U P | P | N | N | |
N | N | 25°C | Group E2 | 2U A | P | N | N | |
N | Y | 25°C | Group D, B, A | 2U P | P | N | N | |
Y | N/Y | 25°C | Group D, B, A | 2U P | P | N | N |
Storage configurations with DWCM
In storage configurations with DWCM, the ambient temperature is limited to 30°C or lower when a part with AOC and at a rate greater than 25 GB is installed.
In storage configurations with DWCM and middle or rear bays, the ambient temperature is limited to 30°C or lower when Gen5 7.68 TB or larger capacity NVMe drives or Gen4 P5336 15.36 TB, 30.72, or 61.44 TB NVMe drives are installed.
Front bays | Support middle bays | Support rear bays | Max. Temp. | Fan type | Support ≥ 64 GB DIMM |
---|---|---|---|---|---|
24 x 2.5" 16 x 2.5" + FIO 12 x 3.5" | N | N | 35°C | S | N |
N | N | 30°C | S | Y | |
N | N/Y | 35°C | P | Y | |
Y | N/Y | 35°C | P | Y |
GPU configurations without DWCM
Half-height half-length (HHHL) single-wide (SW) GPU: A2, L4
HHHL double-wide (DW) GPU: A2000
Full-height full-length (FHFL) DW GPU: A30, A4500, A16, A40, A100, A6000, L40, L40S, H100, RTX 6000 Ada, RTX 4500 Ada, H100 NVL, AMD MI210
- In GPU configurations with 24 x 2.5" or 16 x 2.5" + FIO front bays or GPU configurations with Group E1 processors, a part with AOC and at a rate greater than 25 GB cannot be installed on slot 3, and the following parts are not supported:
Broadcom 57416 10GBASE-T 2-port OCP
Broadcom 57454 10GBASE-T 4-port OCP
- The 6400 MHz 256 GB DIMM is supported in the following GPU configurations without DWCM:
configurations with 8 x 2.5"/FIO/8 x 2.5" + FIO/16 x 2.5"/8 x 3.5" front bays, performance heat sinks, and standard air baffle (at a maximum temperature of 25°C)
configurations with standard heat sinks
Front bays | Max. Temp. | Processor | Heat sink | Air baffle | Max. GPU Qty. | ||||
---|---|---|---|---|---|---|---|---|---|
A2/L4 | A2000 | A40/L40 | 350W DW | Other DW | |||||
8 x 2.5" 8 x 3.5" FIO | 30°C | Group D, B | 2U S | S | 10 | 3 | NA | NA | NA |
Group A | 2U P | S | 10 | 3 | NA | NA | NA | ||
Group D, B, A | 2U P | GPU | NA | NA | 3 | 3 | 3 | ||
25°C | Group E1 | 2U P | S | 6 | 3 | NA | NA | NA | |
Group E1 | 2U P | GPU | NA | NA | 2 (slot 2/5) | 2 (slot 2/5) | 2 (slot 2/5) | ||
16 x 2.5" 8 x 2.5" + FIO | 30°C | Group D, B | 2U S | S | 10 | 3 | NA | NA | NA |
Group A | 2U P | S | 10 | 3 | NA | NA | NA | ||
Group D, B, A | 2U P | GPU | NA | NA | 2 (slot 2/5) | 2 (slot 2/5) | 3 | ||
25°C | Group E1 | 2U P | S | 6 | 3 | NA | NA | NA | |
Group E1 | 2U P | GPU | NA | NA | 2 (slot 2/5) | 2 (slot 2/5) | 2 (slot 2/5) | ||
24 x 2.5" 16 x 2.5" + FIO | 25°C | Group D, B | 2U S | S | 6 | 3 | NA | NA | NA |
Group A | 2U P | S | 6 | 3 | NA | NA | NA | ||
Group D, B, A | 2U P | GPU | NA | NA | 2 (slot 2/5) | 2 (slot 2/5) | 2 (slot 2/5) |
GPU configurations with DWCM
Half-height half-length (HHHL) single-wide (SW) GPU: A2, L4
HHHL double-wide (DW) GPU: A2000
Full-height full-length (FHFL) DW GPU: A30, A4500, A16, A40, A100, A6000, L40, L40S, H100, RTX 6000 Ada, RTX 4500 Ada, H100 NVL, AMD MI210
When a part with active optical cable (AOC) is installed and the rate of the part is greater than 25 GB, the ambient temperature must be limited to 30°C or lower.
In GPU configurations with 8 x 2.5"/FIO/8 x 2.5" + FIO/16 x 2.5"/8 x 3.5" front bays, DWCM, and GPU air baffle, 6400 MHz 64/96/128 GB DIMMs are supported at a maximum temperature of 30°C.
In GPU configurations with 24 x 2.5"/16 x 2.5" + FIO front bays, DWCM, and GPU air baffle, 6400 MHz 64/96/128 GB DIMMs are supported at a maximum temperature of 25°C.
- The 6400 MHz 256 GB DIMM is supported in the following GPU configurations with DWCM:
configurations with 8 x 2.5"/FIO/8 x 2.5" + FIO/16 x 2.5"/8 x 3.5" front bays and GPU air baffle (at a maximum temperature of 25°C)
configurations with 24 x 2.5"/16 x 2.5" + FIO front bays and standard air baffle (at a maximum temperature of 25°C)
Servers with 8 x 2.5" + FIO/16 x 2.5"/8 x 3.5" front bays support up to three A40/A100/L40/MI210/H100/L40S GPU adapters at a maximum temperature of 30°C.
Servers with 24 x 2.5"/16 x 2.5" + FIO front bays support up to three H100/L40S GPU adapters at a maximum temperature of 30°C and three A40/L40 GPU adapters at a maximum temperature of 25°C.
Front bays | Max. Temp. | Processor | Air baffle | Max. GPU Qty. | |
---|---|---|---|---|---|
HHHL | FHFL | ||||
| 35°C | All supported | S | 8 | NA |
GPU | NA | 3 |