Thermal rules for server with DWCM

This topic provides thermal rules for the server with a Direct Water Cooling Module (DWCM).

Abbreviations used in tables below are defined as follows:

Max.Temp.: Maximum ambient temperature at sea level
FIO = riser 5 + front OCP
S/S: SAS/SATA
Any: AnyBay
S: standard
P: performance
A: advanced
NA: not applicable
Y: yes
Y* in the Support middle bays or Support rear bays column: yes (when no Gen5 7.68 TB or larger capacity NVMe drive is installed)
N: no

Standard configurations

This section provides thermal information for standard configurations.

Front bays	Max. Temp.	Air baffle	Fan type
8 x 2.5" 16 x 2.5" 8 x 3.5" 8 x 2.5" + FIO	35°C	S	S

Note

The ambient temperature is limited to 30°C or lower if the server has any of the following components:

ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM-A v1 installed in a standard configuration with standard fans
parts with AOC and at a rate greater than 25 GB

This section provides thermal information for storage configurations.

Front bays	Support middle bays	Support rear bays	Max. Temp.	Air baffle	Fan type
24 x 2.5" 16 x 2.5" + FIO 12 x 3.5"	N	N	35°C	S	S
	N	Y*	35°C	S	P
	Y*	N	35°C	NA	P
	Y*	Y*	35°C	NA	P
	N	Y	30°C	S	P
	Y	N	30°C	NA	P
	Y	Y	30°C	NA	P

Note

The ambient temperature is limited to 30°C or lower if the server has any of the following components:
- ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM-A v1 installed in a storage configuration with 24 x 2.5" front bay and standard fans
- parts with AOC and at a rate greater than 25 GB
ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM-A v1 is not supported in a configuration with 12 x 3.5" front bay and standard fans.
ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM-A v1 is supported in a configuration with 12 x 3.5" front bay and performance fans at a maximum temperature of 25°C.

This section provides thermal information for the GPU configuration.

Half-height half-length (HHHL) single-wide (SW) GPU: A2, L4
HHHL double-wide (DW) GPU: A2000
Full-height full-length (FHFL) DW GPU: A30, A4500, A16, A40, A100, A6000, L40, L40S, H100, AMD MI210

Front bays	Max. Temp.	Air baffle	Fan type	Max. GPU Qty.
Front bays	Max. Temp.	Air baffle	Fan type	A2/L4/A2000	Other DW
8 x 2.5" 16 x 2.5" 8 x 3.5" 24 x 2.5"	35°C	S	P	8	NA
8 x 2.5" 16 x 2.5" 8 x 3.5" 24 x 2.5"	35°C	GPU	P	NA	3
8 x 2.5" + FIO 16 x 2.5" + FIO	30°C	S	P	10	NA
8 x 2.5" + FIO 16 x 2.5" + FIO	35°C	GPU	P	NA	3

Note

For GPU configurations, the ambient temperature is limited to 30°C or lower if the server has any of the following components:
- parts with AOC and at a rate greater than 25 GB
- three 300 W or 350 W GPUs installed in a configuration with 16 x 2.5" or 8 x 3.5" front bay
- three 300 W GPUs installed in an 8 x 2.5" + FIO or 16 x 2.5" + FIO configuration
- three H100 or L40S GPUs installed in a configuration with 24 x 2.5" front bay or in an 8 x 2.5" + FIO or 16 x 2.5" + FIO configuration
- ThinkSystem 96GB TruDDR5 4800MHz (2Rx4) RDIMM-A
- ThinkSystem 128GB TruDDR5 4800MHz (4Rx4) 3DS RDIMM-A v1
The ambient temperature is limited to 25°C or lower when three A40 or L40 GPUs are installed in a configuration with 24 x 2.5" front bay or in an 8 x 2.5" + FIO or 16 x 2.5" + FIO configuration.
ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM-A v1 is not supported in GPU configurations.
The front riser (riser 5) supports only passive SW GPU adapters.

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