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Thermal rules for server with DWCM

This topic provides thermal rules for the server with 9004 series processors and a Direct Water Cooling Module (DWCM).

Abbreviations used in tables below are defined as follows:

  • Max.Temp.: Maximum ambient temperature at sea level

  • FIO = riser 5 + front OCP

  • S/S: SAS/SATA

  • Any: AnyBay

  • S: standard

  • P: performance

  • A: advanced

  • NA: not applicable

  • Y: yes

  • Y* in the Support middle bays or Support rear bays column: yes (when no Gen5 7.68 TB or larger capacity NVMe drive is installed)

  • N: no

Note

For 9184X or 9384X in UEFI Maximum Performance Mode, the processor temperature may reach 95 °C in all configurations, and the processor frequency will be impacted but still meets AMD specifications.

Standard configurations​

This section provides thermal information for standard configurations.

Front bays

Max. Temp.

Air baffle

Fan type

  • 8 x 2.5"

  • 16 x 2.5"

  • 8 x 3.5"

  • 8 x 2.5" + FIO

35°C

S

S

Note

The ambient temperature is limited to 30°C or lower if the server has any of the following components:

  • ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM-A v1 installed in a standard configuration with standard fans

  • parts with AOC and at a rate greater than 25 GB

Storage configurations​

This section provides thermal information for storage configurations.

Front bays

Support middle baysSupport rear bays

Max. Temp.

Air baffle

Fan type

  • 24 x 2.5"

  • 16 x 2.5" + FIO

  • 12 x 3.5"

N

N

35°C

S

S

N

Y*

35°C

S

P

Y*

N

35°C

NA

P

Y*

Y*

35°C

NA

P

N

Y

30°C

S

P

Y

N

30°C

NA

P

Y

Y

30°C

NA

P

Note

  • The ambient temperature is limited to 30°C or lower if the server has any of the following components:

    • ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM-A v1 installed in a storage configuration with 24 x 2.5" front bay and standard fans

    • parts with AOC and at a rate greater than 25 GB

  • ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM-A v1 is not supported in a configuration with 12 x 3.5" front bay and standard fans.

  • ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM-A v1 is supported in a configuration with 12 x 3.5" front bay and performance fans at a maximum temperature of 25°C.

GPU configurations​

This section provides thermal information for the GPU configuration.

  • Half-height half-length (HHHL) single-wide (SW) GPU: A2, L4

  • HHHL double-wide (DW) GPU: A2000

  • Full-height full-length (FHFL) DW GPU: A30, A4500, A16, A40, A100, A6000, L40, L40S, H100, RTX 6000 Ada, RTX 4500 Ada, H100 NVL, AMD MI210

Front bays

Max. Temp.

Air baffle

Fan type

Max. GPU Qty.

A2/L4/A2000

Other DW

  • 8 x 2.5"

  • 16 x 2.5"

  • 8 x 3.5"

  • 24 x 2.5"

35°C

S

P

8

NA

GPU

P

NA

3

  • 8 x 2.5" + FIO

  • 16 x 2.5" + FIO

30°C

S

P

10

NA

35°C

GPU

P

NA

3

Note

  • For GPU configurations, the ambient temperature is limited to 30°C or lower if the server has any of the following components:

    • parts with AOC and at a rate greater than 25 GB

    • three 300 W or 350 W GPUs installed in a configuration with 16 x 2.5" or 8 x 3.5" front bay

    • three 300 W GPUs installed in an 8 x 2.5" + FIO or 16 x 2.5" + FIO configuration

    • three H100 or L40S GPUs installed in a configuration with 24 x 2.5" front bay or in an 8 x 2.5" + FIO or 16 x 2.5" + FIO configuration

    • ThinkSystem 96GB TruDDR5 4800MHz (2Rx4) RDIMM-A

    • ThinkSystem 128GB TruDDR5 4800MHz (4Rx4) 3DS RDIMM-A v1

    • H100 NVL GPU adapter

  • The ambient temperature is limited to 25°C or lower when three A40 or L40 GPUs are installed in a configuration with 24 x 2.5" front bay or in an 8 x 2.5" + FIO or 16 x 2.5" + FIO configuration.

  • ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM-A v1 is not supported in GPU configurations.

  • The front riser (riser 5) supports only passive SW GPU adapters.

  • The 24x2.5" or 16 x 2.5" + FIO GPU configurations do not support the H100 NVL GPU adapter.