Thermal rules for server without DWCM
This topic provides thermal rules for the server without a Direct Water Cooling Module (DWCM).
Max.Temp.: Maximum ambient temperature at sea level
FIO = riser 5 + front OCP
S/S: SAS/SATA
Any: AnyBay
S: standard
P: performance
A: advanced
NA: not applicable
Y: yes
Y* in the Support middle bays or Support rear bays column: yes (when no Gen5 7.68 TB or larger capacity NVMe drive or no Gen4 P5336 15.36 TB/30.72 TB/61.44 TB NVMe drive is installed)
Y1 in the Support DIMMs >= 96 GB column: yes (except ThinkSystem 128GB TruDDR5 4800MHz (4Rx4) 3DS RDIMM-A v1)
N: no
Group B: 200 W ≤ cTDP ≤ 240 W
Group A: 240 W < cTDP ≤ 300 W
Group E: 320 W ≤ cTDP ≤ 400 W
Group E1: 9654(P), 9554(P), 9174F, 9754, 9734, and 9684X.
Group E2: 9654(P), 9554(P), 9174F, 9754, and 9734.
Group E3: 9184X and 9384X
Standard configurations
This section provides thermal information for standard configurations.
| Front bays | Max. Temp. | Processor | Heat sink | Air baffle | Fan type | Support DIMMs >= 96 GB |
|---|---|---|---|---|---|---|
| 45°C | Group B | 2U P | S | P | N |
| 35°C | Group B | 2U S | S | S | N | |
| Group B, A | 2U S | S | P | Y | ||
| Group E1, E3 | 2U A | S | P | Y1 | ||
| 30°C | Group B, A | 2U S | S | P | Y | |
| Group E1 | 2U P | S | P | Y1 | ||
| Group E | 2U A | S | P | Y1 | ||
| 25°C | Group B, A | 2U S | S | P | Y | |
| Group E | 2U P | S | P | Y |
When a part with active optical cable (AOC) is installed and the rate of the part is greater than 25 GB, the ambient temperature must be limited to 30°C or lower.
When the following parts are installed, the ambient temperature must be limited to 35°C or lower.
Broadcom 57416 10GBASE-T 2-port OCP
Broadcom 57454 10GBASE-T 4-port OCP
Network interface cards (NICs) at a rate greater than or equal to 100 GB
Parts with AOC and at the rate of 25 GB
In standard configurations, ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM-A v1 is supported only on servers with standard heat sinks at a maximum temperature of 25°C.
Storage configurations
This section provides thermal information for storage configurations.
| Front bays | Support middle bays | Support rear bays | Max. Temp. | Processor | Heat sink | Air baffle | Fan type | Support DIMMs >= 96 GB |
|---|---|---|---|---|---|---|---|---|
24 x 2.5" 16 x 2.5" + FIO | N | N | 30°C | Group B | 2U S | S | S | N |
| N | N | 30°C | Group B | 2U S | S | P | Y | |
| N | N | 30°C | Group A | 2U P | S | P | Y1 | |
| N | N | 30°C | Group E | 2U A | S | P | Y1 | |
| N | N | 25°C | Group B | 2U S | S | P | Y | |
| N | N | 25°C | Group A, E2 | 2U P | S | P | Y1 | |
| N | N | 25°C | Group E3, 9684X | 2U A | S | P | Y1 | |
| N | Y* | 30°C | Group B | 2U P | S | P | Y1 | |
| Y* | N | 30°C | Group B | 2U P | NA | P | Y1 | |
| Y* | Y* | 30°C | Group B | 2U P | NA | P | Y1 | |
| N | Y | 25°C | Group B, A | 2U P | S | P | Y | |
| Y | N | 25°C | Group B, A | 2U P | NA | P | Y | |
| Y | Y | 25°C | Group B, A | 2U P | NA | P | Y | |
12 x 3.5" | N | N | 30°C | Group B | 2U S | S | P | Y |
| N | N | 30°C | Group A | 2U P | S | P | Y1 | |
| N | N | 30°C | Group E | 2U A | S | P | Y1 | |
| N | Y* | 30°C | Group B | 2U P | S | P | Y1 | |
| Y* | N | 30°C | Group B | 2U P | NA | P | Y1 | |
| Y* | Y* | 30°C | Group B | 2U P | NA | P | Y1 | |
| N | Y | 25°C | Group B, A | 2U P | S | P | Y | |
| Y | N | 25°C | Group B, A | 2U P | NA | P | Y | |
| Y | Y | 25°C | Group B, A | 2U P | NA | P | Y |
- A part with AOC and at a rate greater than 25 GB is supported under the following conditions:
Performance fans are used.
The part is not installed on slot 3.
The following parts are not supported in storage configurations:
Broadcom 57416 10GBASE-T 2-port OCP
Broadcom 57454 10GBASE-T 4-port OCP
Storage configurations do not support ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM-A v1.
GPU configurations without FIO
This section provides thermal information for the GPU configurations without FIO.
Half-height half-length (HHHL) single-wide (SW) GPU: A2, L4
HHHL double-wide (DW) GPU: A2000
Full-height full-length (FHFL) DW GPU: A30, A4500, A16, A40, A100, A6000, L40, L40S, H100, AMD MI210
| Front bays | Max. Temp. | Processor | Heat sink | Air baffle | Fan type | Max. GPU Qty. | Support DIMMs >= 96 GB | ||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| SW | DW (A2000) | DW (A40/L40) | 350W DW | Other DW | |||||||
8 x 2.5" | 30°C | Group B | 2U S | S | P | 10 | 3 | NA | NA | NA | Y |
| Group A | 2U P | S | P | 10 | 3 | NA | NA | NA | Y1 | ||
| Group B, A | 2U P | GPU | P | NA | NA | 3 | 3 | 3 | Y | ||
| 25°C | Group E1, E3 | 2U P | S | P | 6 | 3 | NA | NA | NA | Y | |
| Group E1, E3 | 2U P | GPU | P | NA | NA | 2 (slot 2/5) | 2 (slot 2/5) | 2 (slot 2/5) | Y | ||
16 x 2.5" | 30°C | Group B | 2U S | S | P | 10 | 3 | NA | NA | NA | Y |
| Group A | 2U P | S | P | 10 | 3 | NA | NA | NA | Y1 | ||
| Group B, A | 2U P | GPU | P | NA | NA | 2 (slot 2/5) | 2 (slot 2/5) | 3 | Y | ||
| 25°C | Group E1, E3 | 2U P | S | P | 6 | 3 | NA | NA | NA | Y | |
| Group E1, E3 | 2U P | GPU | P | NA | NA | 2 (slot 2/5) | 2 (slot 2/5) | 2 (slot 2/5) | Y | ||
8 x 3.5" | 30°C | Group B | 2U S | S | P | 10 | 3 | NA | NA | NA | Y |
| Group A | 2U P | S | P | 10 | 3 | NA | NA | NA | Y1 | ||
| Group B, A | 2U P | GPU | P | NA | NA | 3 | 3 | 3 | Y | ||
| 25°C | Group E1, E3 | 2U P | S | P | 6 | 3 | NA | NA | NA | Y | |
| Group E1, E3 | 2U P | GPU | P | NA | NA | 2 (slot 2/5) | 2 (slot 2/5) | 2 (slot 2/5) | Y | ||
24 x 2.5" | 25°C | Group B | 2U S | S | P | 6 | 3 | NA | NA | NA | Y |
| Group A | 2U P | S | P | 6 | 3 | NA | NA | NA | Y1 | ||
| Group B, A | 2U P | GPU | P | NA | NA | 2 (slot 2/5) | 2 (slot 2/5) | 2 (slot 2/5) | Y | ||
- For GPU configurations, the Max. Temp. of 25°C is supported under the following conditions:
A part with AOC and at a rate greater than 25 GB is not installed in slot 3.
The following parts are not installed:
Broadcom 57416 10GBASE-T 2-port OCP
Broadcom 57454 10GBASE-T 4-port OCP
In GPU configurations without FIO, ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM-A v1 is supported only on servers with 8 x 2.5"/16 x 2.5"/8 x 3.5" front bays and Group B processors at a maximum temperature of 25°C.
GPU configurations with FIO
This section provides thermal information for the GPU configurations with FIO.
Half-height half-length (HHHL) single-wide (SW) GPU: A2, L4
HHHL double-wide (DW) GPU: A2000
Full-height full-length (FHFL) DW GPU: A30, A4500, A16, A40, A100, A6000, L40, L40S, H100, AMD MI210
| Front bays | Max. Temp. | Processor | Heat sink | Air baffle | Fan type | Max. GPU Qty. | Support DIMMs >= 96 GB | ||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| SW | DW (A2000) | DW (A40/L40) | 350W DW | Other DW | |||||||
FIO only FIO + 8 x 2.5" | 30°C | Group B | 2U S | S | P | 10 | 3 | NA | NA | NA | Y |
| Group A | 2U P | S | P | 10 | 3 | NA | NA | NA | Y1 | ||
| Group B, A | 2U P | GPU | P | NA | NA | 2 (slot 2/5) | 3 | 3 | Y | ||
| 25°C | Group B | 2U S | S | P | 6 | 3 | NA | NA | NA | Y | |
| Group E1 | 2U P | S | P | 6 | 3 | NA | NA | NA | Y | ||
| Group E1 | 2U P | GPU | P | NA | NA | NA | 2 (slot 2/5) | 2 (slot 2/5) | Y | ||
FIO + 16 x 2.5" | 25°C | Group B | 2U S | S | P | 6 | 3 | NA | NA | NA | Y |
| Group A | 2U P | S | P | 6 | 3 | NA | NA | NA | Y1 | ||
| Group B, A | 2U P | GPU | P | NA | NA | NA | 2 (slot 2/5) | 2 (slot 2/5) | Y | ||
- For GPU configurations, the Max. Temp. of 25°C is supported under the following conditions:
A part with AOC and at a rate greater than 25 GB is not installed in slot 3.
The following parts are not installed:
Broadcom 57416 10GBASE-T 2-port OCP
Broadcom 57454 10GBASE-T 4-port OCP
In GPU configurations with FIO, ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM-A v1 is supported only on servers with FIO or FIO + 8 x 2.5" front bays and Group B processors at a maximum temperature of 25°C.