Thermal rules for server without DWCM

This topic provides thermal rules for the server with 9004 series processors and without a Direct Water Cooling Module (DWCM).

Abbreviations used in tables below are defined as follows:

Max.Temp.: Maximum ambient temperature at sea level
FIO = riser 5 + front OCP
S/S: SAS/SATA
Any: AnyBay
S: standard
P: performance
A: advanced
NA: not applicable
Y: yes
Y* in the Support middle bays or Support rear bays column: yes (when no Gen5 7.68 TB or larger capacity NVMe drive or no Gen4 P5336 15.36 TB/30.72 TB/61.44 TB NVMe drive is installed)
Y¹ in the Support DIMMs >= 96 GB column: yes (except ThinkSystem 128GB TruDDR5 4800MHz (4Rx4) 3DS RDIMM-A v1)
N: no

Processor groups are defined as follows:

Group B: 200 W ≤ cTDP ≤ 240 W
Group A: 240 W < cTDP ≤ 300 W
Group E: 320 W ≤ cTDP ≤ 400 W
Group E¹: 9654(P), 9554(P), 9174F, 9754, 9734, and 9684X.
Group E²: 9654(P), 9554(P), 9174F, 9754, and 9734.
Group E³: 9184X and 9384X

Note

For 9184X or 9384X in UEFI Maximum Performance Mode, the processor temperature may reach 95°C in all configurations, and the processor frequency will be impacted but still meets AMD specifications.

Standard configurations

This section provides thermal information for standard configurations.

Front bays	Max. Temp.	Processor	Heat sink	Air baffle	Fan type	Support DIMMs >= 96 GB
8 x 2.5" 16 x 2.5" 8 x 3.5"	45°C	Group B	2U P	S	P	N
	35°C	Group B	2U S	S	S	N
		Group B, A	2U S	S	P	Y
		Group E¹, E³	2U A	S	P	Y¹
	30°C	Group B, A	2U S	S	P	Y
		Group E¹	2U P	S	P	Y¹
		Group E	2U A	S	P	Y¹
	25°C	Group B, A	2U S	S	P	Y
	25°C	Group E	2U P	S	P	Y

Note

When a part with active optical cable (AOC) is installed and the rate of the part is greater than 25 GB, the ambient temperature must be limited to 30°C or lower.
When the following parts are installed, the ambient temperature must be limited to 35°C or lower.
- Broadcom 57416 10GBASE-T 2-port OCP
- Broadcom 57454 10GBASE-T 4-port OCP
- Network interface cards (NICs) at a rate greater than or equal to 100 GB
- Parts with AOC and at the rate of 25 GB
In standard configurations, ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM-A v1 is supported only on servers with standard heat sinks at a maximum temperature of 25°C.

Storage configurations

This section provides thermal information for storage configurations.

Front bays	Support middle bays	Support rear bays	Max. Temp.	Processor	Heat sink	Air baffle	Fan type	Support DIMMs >= 96 GB
24 x 2.5" 16 x 2.5" + FIO	N	N	30°C	Group B	2U S	S	S	N
	N	N	30°C	Group B	2U S	S	P	Y
	N	N	30°C	Group A	2U P	S	P	Y¹
	N	N	30°C	Group E	2U A	S	P	Y¹
	N	N	25°C	Group B	2U S	S	P	Y
	N	N	25°C	Group A, E²	2U P	S	P	Y¹
	N	N	25°C	Group E³, 9684X	2U A	S	P	Y¹
	N	Y*	30°C	Group B	2U P	S	P	Y¹
	Y*	N	30°C	Group B	2U P	NA	P	Y¹
	Y*	Y*	30°C	Group B	2U P	NA	P	Y¹
	N	Y	25°C	Group B, A	2U P	S	P	Y
	Y	N	25°C	Group B, A	2U P	NA	P	Y
	Y	Y	25°C	Group B, A	2U P	NA	P	Y
12 x 3.5"	N	N	30°C	Group B	2U S	S	P	Y
	N	N	30°C	Group A	2U P	S	P	Y¹
	N	N	30°C	Group E	2U A	S	P	Y¹
	N	Y*	30°C	Group B	2U P	S	P	Y¹
	Y*	N	30°C	Group B	2U P	NA	P	Y¹
	Y*	Y*	30°C	Group B	2U P	NA	P	Y¹
	N	Y	25°C	Group B, A	2U P	S	P	Y
	Y	N	25°C	Group B, A	2U P	NA	P	Y
	Y	Y	25°C	Group B, A	2U P	NA	P	Y

Note

A part with AOC and at a rate greater than 25 GB is supported under the following conditions:
- Performance fans are used.
- The part is not installed on slot 3.
The following parts are not supported in storage configurations:
- Broadcom 57416 10GBASE-T 2-port OCP
- Broadcom 57454 10GBASE-T 4-port OCP
Storage configurations do not support ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM-A v1.

GPU configurations without FIO

This section provides thermal information for the GPU configurations without FIO.

Half-height half-length (HHHL) single-wide (SW) GPU: A2, L4
HHHL double-wide (DW) GPU: A2000
Full-height full-length (FHFL) DW GPU: A30, A4500, A16, A40, A100, A6000, L40, L40S, H100, RTX 6000 Ada, RTX 4500 Ada, H100 NVL, AMD MI210

Front bays	Max. Temp.	Processor	Heat sink	Air baffle	Fan type	Max. GPU Qty.					Support DIMMs >= 96 GB
Front bays	Max. Temp.	Processor	Heat sink	Air baffle	Fan type	SW	DW (A2000)	DW (A40/L40)	350W DW	Other DW	Support DIMMs >= 96 GB
8 x 2.5"	30°C	Group B	2U S	S	P	10	3	NA	NA	NA	Y
		Group A	2U P	S	P	10	3	NA	NA	NA	Y¹
		Group B, A	2U P	GPU	P	NA	NA	3	3	3	Y
	25°C	Group E¹, E³	2U P	S	P	6	3	NA	NA	NA	Y
	25°C	Group E¹, E³	2U P	GPU	P	NA	NA	2 (slot 2/5)	2 (slot 2/5)	2 (slot 2/5)	Y
16 x 2.5"	30°C	Group B	2U S	S	P	10	3	NA	NA	NA	Y
		Group A	2U P	S	P	10	3	NA	NA	NA	Y¹
		Group B, A	2U P	GPU	P	NA	NA	2 (slot 2/5)	2 (slot 2/5)	3	Y
	25°C	Group E¹, E³	2U P	S	P	6	3	NA	NA	NA	Y
	25°C	Group E¹, E³	2U P	GPU	P	NA	NA	2 (slot 2/5)	2 (slot 2/5)	2 (slot 2/5)	Y
8 x 3.5"	30°C	Group B	2U S	S	P	10	3	NA	NA	NA	Y
		Group A	2U P	S	P	10	3	NA	NA	NA	Y¹
		Group B, A	2U P	GPU	P	NA	NA	3	3	3	Y
	25°C	Group E¹, E³	2U P	S	P	6	3	NA	NA	NA	Y
	25°C	Group E¹, E³	2U P	GPU	P	NA	NA	2 (slot 2/5)	2 (slot 2/5)	2 (slot 2/5)	Y
24 x 2.5"	25°C	Group B	2U S	S	P	6	3	NA	NA	NA	Y
		Group A	2U P	S	P	6	3	NA	NA	NA	Y¹
		Group B, A	2U P	GPU	P	NA	NA	2 (slot 2/5)	2 (slot 2/5)	2 (slot 2/5)	Y

Note

For GPU configurations, the Max. Temp. of 25°C is supported under the following conditions:
- A part with AOC and at a rate greater than 25 GB is not installed in slot 3.
- The following parts are not installed:
  - Broadcom 57416 10GBASE-T 2-port OCP
  - Broadcom 57454 10GBASE-T 4-port OCP
In GPU configurations without FIO, ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM-A v1 is supported only on servers with 8 x 2.5"/16 x 2.5"/8 x 3.5" front bays and Group B processors at a maximum temperature of 25°C.
The H100 NVL GPU adapter is supported in a non-24x2.5" GPU configuration under the following conditions:
- The processor TDP is less than or equal to 300 W.
- The ambient temperature is 25°C or lower.

GPU configurations with FIO

This section provides thermal information for the GPU configurations with FIO.

Half-height half-length (HHHL) single-wide (SW) GPU: A2, L4
HHHL double-wide (DW) GPU: A2000
Full-height full-length (FHFL) DW GPU: A30, A4500, A16, A40, A100, A6000, L40, L40S, H100, RTX 6000 Ada, RTX 4500 Ada, H100 NVL, AMD MI210

Front bays	Max. Temp.	Processor	Heat sink	Air baffle	Fan type	Max. GPU Qty.					Support DIMMs >= 96 GB
Front bays	Max. Temp.	Processor	Heat sink	Air baffle	Fan type	SW	DW (A2000)	DW (A40/L40)	350W DW	Other DW	Support DIMMs >= 96 GB
FIO only FIO + 8 x 2.5"	30°C	Group B	2U S	S	P	10	3	NA	NA	NA	Y
		Group A	2U P	S	P	10	3	NA	NA	NA	Y¹
		Group B, A	2U P	GPU	P	NA	NA	2 (slot 2/5)	3	3	Y
	25°C	Group B	2U S	S	P	6	3	NA	NA	NA	Y
		Group E¹	2U P	S	P	6	3	NA	NA	NA	Y
		Group E¹	2U P	GPU	P	NA	NA	NA	2 (slot 2/5)	2 (slot 2/5)	Y
FIO + 16 x 2.5"	25°C	Group B	2U S	S	P	6	3	NA	NA	NA	Y
		Group A	2U P	S	P	6	3	NA	NA	NA	Y¹
		Group B, A	2U P	GPU	P	NA	NA	NA	2 (slot 2/5)	2 (slot 2/5)	Y

Note

For GPU configurations, the Max. Temp. of 25°C is supported under the following conditions:
- A part with AOC and at a rate greater than 25 GB is not installed in slot 3.
- The following parts are not installed:
  - Broadcom 57416 10GBASE-T 2-port OCP
  - Broadcom 57454 10GBASE-T 4-port OCP
In GPU configurations with FIO, ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM-A v1 is supported only on servers with FIO or FIO + 8 x 2.5" front bays and Group B processors at a maximum temperature of 25°C.
The H100 NVL GPU adapter is supported only on servers with FIO or FIO + 8 x 2.5" front bays under the following conditions:
- The processor TDP is less than or equal to 300 W.
- The ambient temperature is 25°C or lower.

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Thermal rules for server without DWCM

Standard configurations​

Storage configurations​

GPU configurations without FIO​

GPU configurations with FIO​

Standard configurations

Storage configurations

GPU configurations without FIO

GPU configurations with FIO