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Thermal rules for server without DWCM

This topic provides thermal rules for the server with 9004 series processors and without a Direct Water Cooling Module (DWCM).

Abbreviations used in tables below are defined as follows:

  • Max.Temp.: Maximum ambient temperature at sea level

  • FIO = riser 5 + front OCP

  • S/S: SAS/SATA

  • Any: AnyBay

  • S: standard

  • P: performance

  • A: advanced

  • NA: not applicable

  • Y: yes

  • Y* in the Support middle bays or Support rear bays column: yes (when no Gen5 7.68 TB or larger capacity NVMe drive or no Gen4 P5336 15.36 TB/30.72 TB/61.44 TB NVMe drive is installed)

  • Y1 in the Support DIMMs >= 96 GB column: yes (except ThinkSystem 128GB TruDDR5 4800MHz (4Rx4) 3DS RDIMM-A v1)

  • N: no

Processor groups are defined as follows:

  • Group B: 200 W ≤ cTDP ≤ 240 W

  • Group A: 240 W < cTDP ≤ 300 W

  • Group E: 320 W ≤ cTDP ≤ 400 W

  • Group E1: 9654(P), 9554(P), 9174F, 9754, 9734, and 9684X.

  • Group E2: 9654(P), 9554(P), 9174F, 9754, and 9734.

  • Group E3: 9184X and 9384X

Note

For 9184X or 9384X in UEFI Maximum Performance Mode, the processor temperature may reach 95 °C in all configurations, and the processor frequency will be impacted but still meets AMD specifications.

Standard configurations​

This section provides thermal information for standard configurations.

Front bays

Max. Temp.

Processor

Heat sink

Air baffle

Fan type

Support DIMMs >= 96 GB

  • 8 x 2.5"

  • 16 x 2.5"

  • 8 x 3.5"

45°C

Group B

2U P

S

P

N

35°C

Group B

2U S

S

S

N

Group B, A

2U S

S

P

Y

Group E1, E3

2U A

S

P

Y1

30°C

Group B, A

2U S

S

P

Y

Group E1

2U P

S

P

Y1

Group E

2U A

S

P

Y1

25°C

Group B, A

2U S

S

P

Y

Group E

2U P

S

P

Y

Note

  • When a part with active optical cable (AOC) is installed and the rate of the part is greater than 25 GB, the ambient temperature must be limited to 30°C or lower.

  • When the following parts are installed, the ambient temperature must be limited to 35°C or lower.

    • Broadcom 57416 10GBASE-T 2-port OCP

    • Broadcom 57454 10GBASE-T 4-port OCP

    • Network interface cards (NICs) at a rate greater than or equal to 100 GB

    • Parts with AOC and at the rate of 25 GB

  • In standard configurations, ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM-A v1 is supported only on servers with standard heat sinks at a maximum temperature of 25°C.

Storage configurations​

This section provides thermal information for storage configurations.

Front bays

Support middle baysSupport rear bays

Max. Temp.

Processor

Heat sink

Air baffle

Fan type

Support DIMMs >= 96 GB

24 x 2.5"

16 x 2.5" + FIO

N

N

30°C

Group B

2U S

S

S

N

N

N

30°C

Group B

2U S

S

P

Y

N

N

30°C

Group A

2U P

S

P

Y1

N

N

30°C

Group E

2U A

S

P

Y1

N

N

25°C

Group B

2U S

S

P

Y

N

N

25°C

Group A, E2

2U P

S

P

Y1

N

N

25°C

Group E3, 9684X

2U A

S

P

Y1

N

Y*

30°C

Group B

2U P

S

P

Y1

Y*

N

30°C

Group B

2U P

NA

P

Y1

Y*

Y*

30°C

Group B

2U P

NA

P

Y1

N

Y

25°C

Group B, A

2U P

S

P

Y

Y

N

25°C

Group B, A

2U P

NA

P

Y

Y

Y

25°C

Group B, A

2U P

NA

P

Y

12 x 3.5"

N

N

30°C

Group B

2U S

S

P

Y

N

N

30°C

Group A

2U P

S

P

Y1

N

N

30°C

Group E

2U A

S

P

Y1

N

Y*

30°C

Group B

2U P

S

P

Y1

Y*

N

30°C

Group B

2U P

NA

P

Y1

Y*

Y*

30°C

Group B

2U P

NA

P

Y1

N

Y

25°C

Group B, A

2U P

S

P

Y

Y

N

25°C

Group B, A

2U P

NA

P

Y

Y

Y

25°C

Group B, A

2U P

NA

P

Y

Note

  • A part with AOC and at a rate greater than 25 GB is supported under the following conditions:

    • Performance fans are used.

    • The part is not installed on slot 3.

  • The following parts are not supported in storage configurations:

    • Broadcom 57416 10GBASE-T 2-port OCP

    • Broadcom 57454 10GBASE-T 4-port OCP

  • Storage configurations do not support ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM-A v1.

GPU configurations without FIO​

This section provides thermal information for the GPU configurations without FIO.

  • Half-height half-length (HHHL) single-wide (SW) GPU: A2, L4

  • HHHL double-wide (DW) GPU: A2000

  • Full-height full-length (FHFL) DW GPU: A30, A4500, A16, A40, A100, A6000, L40, L40S, H100, RTX 6000 Ada, RTX 4500 Ada, H100 NVL, AMD MI210

Front bays

Max. Temp.

Processor

Heat sink

Air baffle

Fan type

Max. GPU Qty.

Support DIMMs >= 96 GB

SW

DW (A2000)

DW (A40/L40)

350W DW

Other DW

8 x 2.5"

30°C

Group B

2U S

S

P

10

3

NA

NA

NA

Y

Group A

2U P

S

P

10

3

NA

NA

NA

Y1

Group B, A

2U P

GPU

P

NA

NA

3

3

3

Y

25°C

Group E1, E3

2U P

S

P

6

3

NA

NA

NA

Y

Group E1, E3

2U P

GPU

P

NA

NA

2 (slot 2/5)

2 (slot 2/5)

2 (slot 2/5)

Y

16 x 2.5"

30°C

Group B

2U S

S

P

10

3

NA

NA

NA

Y

Group A

2U P

S

P

10

3

NA

NA

NA

Y1

Group B, A

2U P

GPU

P

NA

NA

2 (slot 2/5)

2 (slot 2/5)

3

Y

25°C

Group E1, E3

2U P

S

P

6

3

NA

NA

NA

Y

Group E1, E3

2U P

GPU

P

NA

NA

2 (slot 2/5)

2 (slot 2/5)

2 (slot 2/5)

Y

8 x 3.5"

30°C

Group B

2U S

S

P

10

3

NA

NA

NA

Y

Group A

2U P

S

P

10

3

NA

NA

NA

Y1

Group B, A

2U P

GPU

P

NA

NA

3

3

3

Y

25°C

Group E1, E3

2U P

S

P

6

3

NA

NA

NA

Y

Group E1, E3

2U P

GPU

P

NA

NA

2 (slot 2/5)

2 (slot 2/5)

2 (slot 2/5)

Y

24 x 2.5"

25°C

Group B

2U S

S

P

6

3

NA

NA

NA

Y

Group A

2U P

S

P

6

3

NA

NA

NA

Y1

Group B, A

2U P

GPU

P

NA

NA

2 (slot 2/5)

2 (slot 2/5)

2 (slot 2/5)

Y

Note

  • For GPU configurations, the Max. Temp. of 25°C is supported under the following conditions:

    • A part with AOC and at a rate greater than 25 GB is not installed in slot 3.

    • The following parts are not installed:

      • Broadcom 57416 10GBASE-T 2-port OCP

      • Broadcom 57454 10GBASE-T 4-port OCP

  • In GPU configurations without FIO, ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM-A v1 is supported only on servers with 8 x 2.5"/16 x 2.5"/8 x 3.5" front bays and Group B processors at a maximum temperature of 25°C.

  • The H100 NVL GPU adapter is supported in a non-24x2.5" GPU configuration under the following conditions:

    • The processor TDP is less than or equal to 300 W.

    • The ambient temperature is 25°C or lower.

GPU configurations with FIO​

This section provides thermal information for the GPU configurations with FIO.

  • Half-height half-length (HHHL) single-wide (SW) GPU: A2, L4

  • HHHL double-wide (DW) GPU: A2000

  • Full-height full-length (FHFL) DW GPU: A30, A4500, A16, A40, A100, A6000, L40, L40S, H100, RTX 6000 Ada, RTX 4500 Ada, H100 NVL, AMD MI210

Front bays

Max. Temp.

Processor

Heat sink

Air baffle

Fan type

Max. GPU Qty.

Support DIMMs >= 96 GB

SW

DW (A2000)

DW (A40/L40)

350W DW

Other DW

FIO only

FIO + 8 x 2.5"

30°C

Group B

2U S

S

P

10

3

NA

NA

NA

Y

Group A

2U P

S

P

10

3

NA

NA

NA

Y1

Group B, A

2U P

GPU

P

NA

NA

2 (slot 2/5)

3

3

Y

25°C

Group B

2U S

S

P

6

3

NA

NA

NA

Y

Group E1

2U P

S

P

6

3

NA

NA

NA

Y

Group E1

2U P

GPU

P

NA

NA

NA

2 (slot 2/5)

2 (slot 2/5)

Y

FIO + 16 x 2.5"

25°C

Group B

2U S

S

P

6

3

NA

NA

NA

Y

Group A

2U P

S

P

6

3

NA

NA

NA

Y1

Group B, A

2U P

GPU

P

NA

NA

NA

2 (slot 2/5)

2 (slot 2/5)

Y

Note

  • For GPU configurations, the Max. Temp. of 25°C is supported under the following conditions:

    • A part with AOC and at a rate greater than 25 GB is not installed in slot 3.

    • The following parts are not installed:

      • Broadcom 57416 10GBASE-T 2-port OCP

      • Broadcom 57454 10GBASE-T 4-port OCP

  • In GPU configurations with FIO, ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM-A v1 is supported only on servers with FIO or FIO + 8 x 2.5" front bays and Group B processors at a maximum temperature of 25°C.

  • The H100 NVL GPU adapter is supported only on servers with FIO or FIO + 8 x 2.5" front bays under the following conditions:

    • The processor TDP is less than or equal to 300 W.

    • The ambient temperature is 25°C or lower.