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Thermal rules for server without DWCM

This topic provides thermal rules for the server with 9004 series processors and without a Direct Water Cooling Module (DWCM).

Abbreviations used in tables below are defined as follows:
  • Max.Temp.: Maximum ambient temperature at sea level

  • FIO = riser 5 + front OCP

  • S/S: SAS/SATA

  • Any: AnyBay

  • S: standard

  • P: performance

  • A: advanced

  • NA: not applicable

  • Y: yes

  • Y* in the Support middle bays or Support rear bays column: yes (when no Gen5 7.68 TB or larger capacity NVMe drive or no Gen4 P5336 15.36 TB/30.72 TB/61.44 TB NVMe drive is installed)

  • Y1 in the Support DIMMs >= 96 GB column: yes (except ThinkSystem 128GB TruDDR5 4800MHz (4Rx4) 3DS RDIMM-A v1)

  • N: no

Processor groups are defined as follows:
  • Group B: 200 W ≤ cTDP ≤ 240 W

  • Group A: 240 W < cTDP ≤ 300 W

  • Group E: 320 W ≤ cTDP ≤ 400 W

  • Group E1: 9654(P), 9554(P), 9174F, 9754, 9734, and 9684X.

  • Group E2: 9654(P), 9554(P), 9174F, 9754, and 9734.

  • Group E3: 9184X and 9384X

Note
  • For 9184X or 9384X in UEFI Maximum Performance Mode, the processor temperature may reach 95°C in all configurations, and the processor frequency will be impacted but still meets AMD specifications.

  • ThinkSystem NVIDIA BlueField-3 VPI QSFP112 2P 200G PCIe Gen5 x16 is supported under the following conditions:
    • The ambient temperature is 25°C or lower.

    • The processor TDP is less than or equal to 300 W.

    • The GPU air baffle and performance fans are used.

    • The server is not equipped with 24 x 2.5", 16 x 2.5" + FIO, or 12 x 3.5" front drive bays.

Standard configurations

This section provides thermal information for standard configurations.

Front baysMax. Temp.ProcessorHeat sinkAir baffleFan typeSupport DIMMs >= 96 GB
  • 8 x 2.5"

  • 16 x 2.5"

  • 8 x 3.5"

45°CGroup B2U PSPN
35°CGroup B2U SSSN
Group B, A2U SSPY
Group E1, E32U ASPY1
30°CGroup B, A2U SSPY
Group E12U PSPY1
Group E2U ASPY1
25°CGroup B, A2U SSPY
Group E2U PSPY
Note
  • When a part with active optical cable (AOC) is installed and the rate of the part is greater than 25 GB, the ambient temperature must be limited to 30°C or lower.

  • When the following parts are installed, the ambient temperature must be limited to 35°C or lower.

    • Broadcom 57416 10GBASE-T 2-port OCP

    • Broadcom 57454 10GBASE-T 4-port OCP

    • Network interface cards (NICs) at a rate greater than or equal to 100 GB

    • Parts with AOC and at the rate of 25 GB

  • In standard configurations, ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM-A v1 is supported only on servers with standard heat sinks at a maximum temperature of 25°C.

Storage configurations

This section provides thermal information for storage configurations.

Front baysSupport middle baysSupport rear baysMax. Temp.ProcessorHeat sinkAir baffleFan typeSupport DIMMs >= 96 GB

24 x 2.5"

16 x 2.5" + FIO

NN30°CGroup B2U SSSN
NN30°CGroup B2U SSPY
NN30°CGroup A2U PSPY1
NN30°CGroup E2U ASPY1
NN25°CGroup B2U SSPY
NN25°CGroup A, E22U PSPY1
NN25°CGroup E3, 9684X2U ASPY1
NY*30°CGroup B2U PSPY1
Y*N30°CGroup B2U PNAPY1
Y*Y*30°CGroup B2U PNAPY1
NY25°CGroup B, A2U PSPY
YN25°CGroup B, A2U PNAPY
YY25°CGroup B, A2U PNAPY

12 x 3.5"

NN30°CGroup B2U SSPY
NN30°CGroup A2U PSPY1
NN30°CGroup E2U ASPY1
NY*30°CGroup B2U PSPY1
Y*N30°CGroup B2U PNAPY1
Y*Y*30°CGroup B2U PNAPY1
NY25°CGroup B, A2U PSPY
YN25°CGroup B, A2U PNAPY
YY25°CGroup B, A2U PNAPY
Note
  • A part with AOC and at a rate greater than 25 GB is supported under the following conditions:
    • Performance fans are used.

    • The part is not installed on slot 3.

  • The following parts are not supported in storage configurations:

    • Broadcom 57416 10GBASE-T 2-port OCP

    • Broadcom 57454 10GBASE-T 4-port OCP

  • Storage configurations do not support ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM-A v1.

GPU configurations without FIO

This section provides thermal information for the GPU configurations without FIO.

  • Half-height half-length (HHHL) single-wide (SW) GPU: A2, L4

  • HHHL double-wide (DW) GPU: A2000

  • Full-height full-length (FHFL) DW GPU: A30, A4500, A16, A40, A100, A6000, L40, L40S, H100, RTX 6000 Ada, RTX 4500 Ada, H100 NVL, AMD MI210

Front baysMax. Temp.ProcessorHeat sinkAir baffleFan typeMax. GPU Qty.Support DIMMs >= 96 GB
SWDW (A2000)DW (A40/L40)350W DWOther DW

8 x 2.5"

30°CGroup B2U SSP103NANANAY
Group A2U PSP103NANANAY1
Group B, A2U PGPUPNANA333Y
25°CGroup E1, E32U PSP63NANANAY
Group E1, E32U PGPUPNANA2 (slot 2/5)2 (slot 2/5)2 (slot 2/5)Y

16 x 2.5"

30°CGroup B2U SSP103NANANAY
Group A2U PSP103NANANAY1
Group B, A2U PGPUPNANA2 (slot 2/5)2 (slot 2/5)3Y
25°CGroup E1, E32U PSP63NANANAY
Group E1, E32U PGPUPNANA2 (slot 2/5)2 (slot 2/5)2 (slot 2/5)Y

8 x 3.5"

30°CGroup B2U SSP103NANANAY
Group A2U PSP103NANANAY1
Group B, A2U PGPUPNANA333Y
25°CGroup E1, E32U PSP63NANANAY
Group E1, E32U PGPUPNANA2 (slot 2/5)2 (slot 2/5)2 (slot 2/5)Y

24 x 2.5"

25°CGroup B2U SSP63NANANAY
Group A2U PSP63NANANAY1
Group B, A2U PGPUPNANA2 (slot 2/5)2 (slot 2/5)2 (slot 2/5)Y
Note
  • For GPU configurations, the Max. Temp. of 25°C is supported under the following conditions:
    • A part with AOC and at a rate greater than 25 GB is not installed in slot 3.

    • The following parts are not installed:

      • Broadcom 57416 10GBASE-T 2-port OCP

      • Broadcom 57454 10GBASE-T 4-port OCP

  • In GPU configurations without FIO, ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM-A v1 is supported only on servers with 8 x 2.5"/16 x 2.5"/8 x 3.5" front bays and Group B processors at a maximum temperature of 25°C.

  • The H100 NVL GPU adapter is supported in a non-24x2.5" GPU configuration under the following conditions:
    • The processor TDP is less than or equal to 300 W.

    • The ambient temperature is 25°C or lower.

GPU configurations with FIO

This section provides thermal information for the GPU configurations with FIO.

  • Half-height half-length (HHHL) single-wide (SW) GPU: A2, L4

  • HHHL double-wide (DW) GPU: A2000

  • Full-height full-length (FHFL) DW GPU: A30, A4500, A16, A40, A100, A6000, L40, L40S, H100, RTX 6000 Ada, RTX 4500 Ada, H100 NVL, AMD MI210

Front baysMax. Temp.ProcessorHeat sinkAir baffleFan typeMax. GPU Qty.Support DIMMs >= 96 GB
SWDW (A2000)DW (A40/L40)350W DWOther DW

FIO only

FIO + 8 x 2.5"

30°CGroup B2U SSP103NANANAY
Group A2U PSP103NANANAY1
Group B, A2U PGPUPNANA2 (slot 2/5)33Y
25°CGroup B2U SSP63NANANAY
Group E12U PSP63NANANAY
Group E12U PGPUPNANANA2 (slot 2/5)2 (slot 2/5)Y

FIO + 16 x 2.5"

25°CGroup B2U SSP63NANANAY
Group A2U PSP63NANANAY1
Group B, A2U PGPUPNANANA2 (slot 2/5)2 (slot 2/5)Y
Note
  • For GPU configurations, the Max. Temp. of 25°C is supported under the following conditions:
    • A part with AOC and at a rate greater than 25 GB is not installed in slot 3.

    • The following parts are not installed:

      • Broadcom 57416 10GBASE-T 2-port OCP

      • Broadcom 57454 10GBASE-T 4-port OCP

  • In GPU configurations with FIO, ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM-A v1 is supported only on servers with FIO or FIO + 8 x 2.5" front bays and Group B processors at a maximum temperature of 25°C.

  • The H100 NVL GPU adapter is supported only on servers with FIO or FIO + 8 x 2.5" front bays under the following conditions:
    • The processor TDP is less than or equal to 300 W.

    • The ambient temperature is 25°C or lower.