Thermal rules for server with 9005 series processors

This topic provides thermal rules for the server with 9005 series processors.

Abbreviations used in tables below are defined as follows:

Max.Temp.: Maximum ambient temperature at sea level
DWCM: Direct Water Cooling Module
FIO = riser 5 + front OCP
S/S: SAS/SATA
Any: AnyBay
S: standard
P: performance
A: advanced
NA: not applicable
Y: yes
Y* in the Support middle bays or Support rear bays column: yes (when no Gen5 7.68 TB or larger capacity NVMe drive or no Gen4 P5336 15.36 TB/30.72 TB/61.44 TB NVMe drive is installed)
N: no

Processor groups are defined as follows:

Group B: 9135
Group A: 9355
Group E¹: 9555, 9655
Group E²: 9575F

Standard configurations

This section provides thermal information for standard configurations.

Front bays	Max. Temp.	Processor	Heat sink	Air baffle	Fan type	Support ≥ 64 GB DIMM
8 x 2.5" 16 x 2.5" 8 x 3.5" FIO 8 x2.5"+FIO	35°C	All supported	DWCM	S	S	N
		All supported	DWCM	S	P	Y
		Group B	2U S	S	S	N
		Group B, A	2U S	S	P	Y
		Group E¹	2U A	S	P	Y
	30°C	All supported	DWCM	S	S	Y
		Group E¹	2U P	S	P	Y
		Group E²	2U A	S	P	Y
	25°C	Group E²	2U P	S	P	Y

Note

When a part with active optical cable (AOC) is installed and the rate of the part is greater than 25 GB, the ambient temperature must be limited to 30°C or lower.
In standard configurations with DWCM and standard fans, the ambient temperature must be limited to 30°C or lower when the following parts are installed:
- Broadcom 57416 10GBASE-T 2-port OCP
- Broadcom 57454 10GBASE-T 4-port OCP

Storage configurations without DWCM

This section provides thermal information for storage configurations without DWCM.

Front bays	Support middle bays	Support rear bays	Max. Temp.	Processor	Heat sink	Air baffle	Fan type	Support ≥ 64 GB DIMM
24 x 2.5" 16 x 2.5" + FIO	N	N	30°C	Group B	2U S	S	S	N
	N	N	30°C	Group B	2U S	S	P	Y
	N	N	30°C	Group A	2U P	S	P	N
	N	N	30°C	Group E¹, E²	2U A	S	P	N
	N	Y*	30°C	Group B	2U P	S	P	N
	Y*	N/Y*	30°C	Group B	2U P	NA	P	N
	N	N	25°C	Group A, E¹	2U P	S	P	Y
	N	N	25°C	Group E²	2U A	S	P	Y
	N	Y	25°C	Group B, A	2U P	S	P	Y
	Y	N/Y	25°C	Group B, A	2U P	NA	P	Y
12 x 3.5"	N	N	30°C	Group B	2U S	S	P	Y
	N	N	30°C	Group A	2U P	S	P	N
	N	N	30°C	Group E¹, E²	2U A	S	P	N
	N	Y*	30°C	Group B	2U P	S	P	N
	Y*	N/Y*	30°C	Group B	2U P	NA	P	N
	N	N	25°C	Group E¹	2U P	S	P	N
	N	Y	25°C	Group B, A	2U P	S	P	N
	Y	N/Y	25°C	Group B, A	2U P	NA	P	N

Note

In storage configurations without DWCM, a part with AOC and at a rate greater than 25 GB is supported under the following conditions:
- Performance fans are used.
- The part is not installed on slot 3.
- The ambient temperature is 30°C or lower.
The following parts are not supported in storage configurations without DWCM:
- Broadcom 57416 10GBASE-T 2-port OCP
- Broadcom 57454 10GBASE-T 4-port OCP

Storage configurations with DWCM

This section provides thermal information for storage configurations with DWCM.

Front bays	Support middle bays	Support rear bays	Max. Temp.	Air baffle	Fan type	Support ≥ 64 GB DIMM
24 x 2.5" 16 x 2.5" + FIO 12 x 3.5"	N	N	35°C	S	S	N
	N	N	30°C	S	S	Y
	N	N/Y	35°C	S	P	Y
	Y	N/Y	35°C	NA	P	Y

Note

In storage configurations with DWCM, the ambient temperature is limited to 30°C or lower when any of the following parts is installed:
- a part with AOC and at a rate greater than 25 GB
- Broadcom 57416 10GBASE-T 2-port OCP
- Broadcom 57454 10GBASE-T 4-port OCP
In storage configurations with DWCM and middle or rear bays, the ambient temperature is limited to 30°C or lower when Gen5 7.68 TB or larger capacity NVMe drives or Gen4 P5336 15.36 TB, 30.72, or 61.44 TB NVMe drives are installed.

GPU configurations

This section provides thermal information for GPU configurations.

Half-height half-length (HHHL) single-wide (SW) GPU: A2, L4
HHHL double-wide (DW) GPU: A2000
Full-height full-length (FHFL) DW GPU: A30, A4500, A16, A40, A100, A6000, L40, L40S, H100, RTX 6000 Ada, RTX 4500 Ada, H100 NVL, AMD MI210

Front bays	Max. Temp.	Processor	Heat sink	Air baffle	Fan type	Max. GPU Qty.
Front bays	Max. Temp.	Processor	Heat sink	Air baffle	Fan type	SW	DW (A2000)	DW (A40/L40)	350W DW	Other DW
8 x 2.5" 8 x 3.5" FIO	30°C	Group B	2U S	S	P	10	3	NA	NA	NA
		Group A	2U P	S	P	10	3	NA	NA	NA
		Group B, A	2U P	GPU	P	NA	NA	3	3	3
	25°C	Group E¹	2U P	S	P	6	3	NA	NA	NA
	25°C	Group E¹	2U P	GPU	P	NA	NA	2 (slot 2/5)	2 (slot 2/5)	2 (slot 2/5)
16 x 2.5" 8 x 2.5" + FIO	30°C	Group B	2U S	S	P	10	3	NA	NA	NA
		Group A	2U P	S	P	10	3	NA	NA	NA
		Group B, A	2U P	GPU	P	NA	NA	2 (slot 2/5)	2 (slot 2/5)	3
	25°C	Group E¹	2U P	S	P	6	3	NA	NA	NA
	25°C	Group E¹	2U P	GPU	P	NA	NA	2 (slot 2/5)	2 (slot 2/5)	2 (slot 2/5)
24 x 2.5" 16 x 2.5" + FIO	25°C	Group B	2U S	S	P	6	3	NA	NA	NA
		Group A	2U P	S	P	6	3	NA	NA	NA
		Group B, A	2U P	GPU	P	NA	NA	2 (slot 2/5)	2 (slot 2/5)	2 (slot 2/5)

Note

In GPU configurations with 24 x 2.5" or 16 x 2.5" + FIO front bays or GPU configurations with Group E¹ processors, a part with AOC and at a rate greater than 25 GB cannot be installed on slot 3, and the following parts are not supported:

Broadcom 57416 10GBASE-T 2-port OCP
Broadcom 57454 10GBASE-T 4-port OCP

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Thermal rules for server with 9005 series processors

Standard configurations​

Storage configurations without DWCM​

Storage configurations with DWCM​

GPU configurations​

Standard configurations

Storage configurations without DWCM

Storage configurations with DWCM

GPU configurations