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Remove a processor

This task has instructions for removing an assembled processor.

About this task

Attention
The system will load factory default UEFI settings when Processor 1 is removed. In this case, make sure to back up the UEFI settings before processor 1 removal.

Required tools

Make sure you have the required tools listed below in hand to properly replace the component.

  • SD665-N V3 Water Loop Service Kit (The water loop carrier in the Service Kit is reusable, it is recommended to keep it at the facility where the server operates for future replacement needs.)

  • SD665-N V3 Water Loop Putty Pad Kit

  • SD665-N V3 OSFP Putty Pad Kit

    Putty pad cannot be reused. Whenever the water loop is removed, putty pads must be replaced with new ones before reinstalling the water loop.

  • Drive gap pad or putty pad kits according to the drives installed in the tray. See their respective replacement procedures for more information.

  • Screws and screwdrivers

    Prepare the following screwdrivers to ensure you can install and remove corresponding screws properly.
    Screwdriver TypeScrew Type
    Hex screw (GPU node water loop)6 mm hex head screwdriver
    Hex screw (OSFP module conduction plate)4.5 mm hex head screwdriver
    Torx T10 head screwdriverTorx T10 screw
    Torx T20 head screwdriverTorx T20 screw
    Phillips #1 head screwdriverPhillips #1 screw
    Phillips #2 head screwdriverPhillips #2 screw
Attention
  • Read Installation Guidelines and Safety inspection checklist to ensure that you work safely.

  • Turn off the corresponding DWC tray that you are going to perform the task on.

  • Disconnect all external cables from the enclosure.

  • Use extra force to disconnect QSFP cables if they are connected to the solution.

  • Each processor socket must always contain a cover. When removing or installing a processor, protect empty processor sockets with a cover.

  • Do not touch the processor socket or processor contacts. Processor-socket contacts are very fragile and easily damaged. Contaminants on the processor contacts, such as oil from your skin, can cause connection failures.

  • Do not allow the thermal grease on the processor or water loop to come in contact with anything. Contact with any surface can compromise the thermal grease, rendering it ineffective. Thermal grease can damage components, such as electrical connectors in the processor socket. Do not remove the grease cover from the cold plate until you are instructed to do so.

  • Before you install a new or replace a processor, update your system firmware to the latest level. See Update the firmware.

  • To avoid damaging the water loop, always use the water loop carrier when removing, installing or folding the water loop.

Attention

If processor socket 2 is empty, DIMM fillers should be removed from the DIMM slots surrounding socket 2 (slot 13 to slot 24).

Figure 1. Processor locations
Processor locations

Procedure

Note
Depending on the model, your solution might look slightly different from the illustration.

  1. Make preparations for this task.
    1. Remove the tray from the enclosure. See Remove a DWC tray from the enclosure.
    2. Remove the tray cover. See Remove the tray cover.
    3. Remove the cross braces. See Remove the cross braces.
    4. Remove the DIMM comb. See Remove a DIMM comb.
    5. Remove memory modules. See Remove a memory module.
    6. Remove the M.2 backplane assembly. See Remove the M.2 backplane assembly.
    7. Remove the bus bar. See Remove the bus bar.
    8. Remove the MCIO cables. Follow the guidance and routing information in Internal cable routing.
    9. Remove the drive cage. See Remove a drive cage assembly.
    10. Remove the OSFP module. See Remove the OSFP module.
  2. Remove the two Hex screws from the OSFP module with a 4.5 mm hex head screwdriver.
    Figure 2. OSFP module conduction plate Hex screws removal
    OSFP module conduction plate Hex screws removal
  3. Remove the OSFP module conduction plate. With alcohol cleaning pads, wipe of any remaining putty pads from the conduction plate.
    Screw TypeScrewdriver Type
    1 M3x5 screw (x3)Phillips #1 head screwdriver
    2 M3 screw (x2)T10 screwdriver
    Figure 3. OSFP module conduction plate removal
    Removing the OSFP module conduction plate
  4. Remove the five Torx T10 screws to loosen the quick connect.
    Note
    For reference, the torque required for the screws to be fully tightened/removed is 5.0+/- 0.5 lbf-in, 0.55+/- 0.05 N-M.
    Figure 4. Quick connect screw removal (Compute node)
    Quick connect screw removal
  5. Remove water loop screws and quick connect screws (14x Torx T10 screws per node) with a torque screwdriver set to the proper torque.
    Note
    • For reference, the torque required for the screws to be fully tightened/removed is 5.0+/- 0.5 lbf-in, 0.55+/- 0.05 N-M.

    • When removing the 1 VR cold plate screws (x2), remove the washers, too. Make sure to keep the washers for future use.

      Figure 5. VR cold plate screws with washer
      VR cold plate screws with washer
    Figure 6. Water loop screw removal

    1 VR cold plate screws (x2)


  6. Remove processor cold plate screws (12x Torx T20 screws per node). Follow the screw sequence specified on the processor cold plate label and loosen the screws with a general screwdriver. Fully loosen each screw; then, proceed to the next screw.
    Note
    For reference, the torque required for the screws to be fully tightened/removed is 1.12-1.46 newton-meters, 10-13 inch-pounds
    Figure 7. Processor cold plate label

    Fully loosen each screw in this order: 6 > 5 > 4 > 3 > 2 > 1


    Processor cold plate label
    Figure 8. Processor cold plate removal
    Processor cold plate removal
  7. Orient the water loop carrier with the guide pin; then, gently put the water loop carrier down and ensure it is seated firmly on the water loop.
    Figure 9. Water loop carrier installation (Compute node)
    Water loop carrier installation (Compute node)
  8. Tighten water loop carrier screws (x12 Phillips #2 screws).
    Note
    Select screw holes marked as R on the rear of the shipping bracket.
    Figure 10. Water loop carrier screws installation (Compute node)
    Water loop carrier screws installation (Compute node)
  9. Rotate the latch on the water loop carrier to separate the water loop from processors.
    Figure 11. Separate water loop from processor
    Separate water loop from processor
  10. Carefully rotate the water loop so one half is sitting on top of the other half.
    Note
    Do not title the water loop. Keep the water loop horizontal with the tray.
    Figure 12. Folding the water loop
    Folding the water loop
  11. Remove the processor
    1. Use a Torx T20 screwdriver to loosen the retention frame screw; then, rotate the retention frame to the open position
    2. Slightly lift up the rail frame in the direction shown. The processor in the rail frame is spring-loaded.
    3. Hold the blue tab of the processor carrier and slide the processor carrier out of the rail frame.
    Note

    If processor socket 2 is empty, DIMM fillers should be removed from the DIMM slots surrounding socket 2 (slot 13 to slot 24).

    Figure 13. Processor removal
    Processor removal
  12. Without putting the processor down, wipe off the thermal grease from the top of the processor with an alcohol cleaning pad; then, place the processor on a static protective surface with the processor-contact side up.
  13. With an alcohol cleaning pad, wipe off any remaining thermal grease, gap pad, and putty pad from the water loop.
After you finish

If you are instructed to return the component or optional device, follow all packaging instructions, and use any packaging materials for shipping that are supplied to you.

Demo video

Watch the procedure on YouTube