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Install a processor

This task has instructions for installing a processor.

About this task

Important
Gap pad/putty pad replacement guidelines
  • To identify the gap pad/putty pad location and orientation, see:

  • Before replacing the gap pad/putty pad, gently clean the interface plate or the hardware surface with an alcohol cleaning pad.

  • Hold the gap pad/putty pad carefully to avoid deformation. Make sure no screw hole or opening is blocked by the gap pad/putty pad material.

  • Do not use expired putty pad. Check the expiry date on putty pad package. If the putty pads are expired, acquire new ones to properly replace them.

Required tools

Make sure you have the required tools listed below in hand to properly replace the component.

  • SD665-N V3 Water Loop Service Kit (The water loop carrier in the Service Kit is reusable, it is recommended to keep it at the facility where the server operates for future replacement needs.)

  • SD665-N V3 Water Loop Putty Pad Kit

  • SD665-N V3 OSFP Putty Pad Kit

    Putty pad cannot be reused. Whenever the water loop is removed, putty pads must be replaced with new ones before reinstalling the water loop.

  • Drive gap pad or putty pad kits according to the drives installed in the tray. See their respective replacement procedures for more information.

  • Screws and screwdrivers

    Prepare the following screwdrivers to ensure you can install and remove corresponding screws properly.
    Screwdriver TypeScrew Type
    Hex screw (GPU node water loop)6 mm hex head screwdriver
    Hex screw (OSFP module conduction plate)4.5 mm hex head screwdriver
    Torx T10 head screwdriverTorx T10 screw
    Torx T20 head screwdriverTorx T20 screw
    Phillips #1 head screwdriverPhillips #1 screw
    Phillips #2 head screwdriverPhillips #2 screw
Attention
  • Read Installation Guidelines and Safety inspection checklist to ensure that you work safely.

  • Turn off the corresponding DWC tray that you are going to perform the task on.

  • Disconnect all external cables from the enclosure.

  • Use extra force to disconnect QSFP cables if they are connected to the solution.

  • Each processor socket must always contain a cover. When removing or installing a processor, protect empty processor sockets with a cover.

  • Do not touch the processor socket or processor contacts. Processor-socket contacts are very fragile and easily damaged. Contaminants on the processor contacts, such as oil from your skin, can cause connection failures.

  • Do not allow the thermal grease on the processor or water loop to come in contact with anything. Contact with any surface can compromise the thermal grease, rendering it ineffective. Thermal grease can damage components, such as electrical connectors in the processor socket. Do not remove the grease cover from the cold plate until you are instructed to do so.

  • Before you install a new or replace a processor, update your system firmware to the latest level. See Update the firmware.

  • To avoid damaging the water loop, always use the water loop carrier when removing, installing or folding the water loop.

Note
  • See Lenovo ServerProven website for a list of processors supported for your system. All processors on the system board must have the same speed, number of cores, and frequency.

  • Optional devices available for your system might have specific processor requirements. See the documentation that comes with the optional device for information.

Attention

If processor socket 2 is empty, DIMM fillers should be removed from the DIMM slots surrounding socket 2 (slot 13 to slot 24).

Figure 1. Processor locations
Processor locations
Firmware and driver download: You might need to update the firmware or driver after replacing a component.

Procedure

Note

Depending on the model, your solution might look slightly different from the illustration.

Attention

If processor socket 2 is empty, DIMM fillers should be removed from the DIMM slots surrounding socket 2 (slot 13 to slot 24).

  1. Follow the following steps if you are replacing processors:
    1. If there is any old thermal grease on the bottom of the cold plate on water loop, gently clean the thermal grease using an alcohol cleaning pad.
    2. Remove the processor identification label from the water loop and replace it with the new label that comes with the replacement processor. If you are unable to remove the label and place it on the new water loop, or if the label is damaged during transfer, write the processor serial number from the processor identification label on the new water loop in the same location as the label would be placed using a permanent marker.
  2. Install the processor.
    1. Slide the processor carrier into the rail frame.
      Attention
      Make sure the processor carrier is well seated inside the rail frame.
    2. Use index finger of both hands to press down the rail frame.
    3. Use the index finger of both hands to push the rail frame down until the blue latches lock into place.
      Figure 2. Install the processor into the rail frame

    4. There are two semicircular cutouts and one oval cutout on the rail frame. Make sure the studs on the processor socket are seated in the center of these three cutouts. If the stud is seated near left side or right side, the stud placement is incorrect. If the stud placement is incorrect, repeat Step 2.1, 2.2, and 2.3 (, , and ) to reinstall the processor carrier to the rail frame until the placement is correct.
      Figure 3. Processor socket studs placement

    5. Slightly press the processor carrier to ensure the processor is correctly seated in the socket..
      Attention
      To avoid processor damage, do not apply excessive force to the processor. Pressing on the processor can be done only when the processor socket studs are in the center of the semicircular cutouts.
    6. Close the retention frame.
    7. Use a Torx T20 screwdriver to tighten the screw.
      Figure 4. Securing the retention frame to the processor socket

  3. Apply the thermal grease on the top of the processor with syringe by forming four uniformly spaced dots, while each dot consists of about 0.1 ml of thermal grease.
    Note
    Carefully place the processor and retainer on a flat surface with the processor-contact side down.
    Figure 5. Thermal grease application
    Applying thermal grease
  4. If needed, remove plastic grease covers from the underside of processor cold plates.
    Figure 6. Plastic grease covers removal
    Plastic grease covers removal
  5. Check the gap pads on the bottom side and top side of the water loop, if any of them are damaged or missing, replace them with the new ones.
    Figure 7. Water loop gap pads (bottom side)
    Water loop gap pads (bottom side)
    Figure 8. Water loop gap pads (top side)
    Water loop gap pads (top side)

Make sure to follow Gap pad/putty pad replacement guidelines.

  1. Replace the putty pads on the water loop with new ones.
    Attention
    Putty pad cannot be reused. Whenever a component is removed, putty pads must be replaced with new ones before reinstalling the component.
    Figure 9. Water loop putty pads
    Water loop putty pads

Make sure to follow Gap pad/putty pad replacement guidelines.

  1. Carefully rotate the top side of the water loop, position the water loop on the two guide pins near the rear of the node; then, gently put the water loop down and ensure it is firmly seated on the system board.
    Attention
    Make sure to align the water loop with the three guide pins on the right side compute node.
    Figure 10. Guide pins on the compute node
    Guide pins on the compute node
    Attention
    1. Slightly lift the water loop, then rotate it.

    2. Do not tilt the water loop. Keep the water loop horizontal with the tray.

    3. Install the water loop to the tray

    Figure 11. Water loop installation
    Water loop installation
  2. Install processor cold plate screws (x12 Torx T20 screws for the CPU node). Follow the screw sequence specified below and tighten the screws with a torque screwdriver. Fully tighten each screw; then, proceed to the next screw.
    Note
    For reference, the torque required for the screws to be fully tightened/removed is 1.12-1.46 newton-meters, 10-13 inch-pounds
    Figure 12. Processor cold plate installation
    Fully tighten each screw the order below:
    ProcessorScrew sequence
    A2 > 1 > 4 > 6 > 5 > 3
    B2 > 1 > 5 > 3 > 4 > 6

    Processor cold plate label

    Processor cold plate installation
  3. Loosen water loop carrier screws (12x Phillips #2 screws).
    Note
    Select screw holes marked as R on the rear of the shipping bracket.
    Figure 13. Loosening water loop carrier screws
    Water loop carrier screws removal
  4. Remove the water loop carrier from the compute node.
    Figure 14. Water loop carrier removal (Compute node)
    Water loop carrier removal (Compute node)
  5. Install water loop screws and quick connect screws (14x Torx T10 screws per node) with a torque screwdriver set to the proper torque.
    Note
    • For reference, the torque required for the screws to be fully tightened/removed is 5.0+/- 0.5 lbf-in, 0.55+/- 0.05 N-M.

    • Install the 1 VR cold plate screws (x2) with washers. Use the washers previously removed from the water loop.

    Figure 15. VR cold plate screws with washer
    VR cold plate screws with washer
    Figure 16. Water loop screws and quick connect screws installation


    Water loop screws and quick connect screws installation
  6. Install the five Torx T10 screws to secure the quick connect.
    Note
    For reference, the torque required for the screws to be fully tightened/removed is 5.0+/- 0.5 lbf-in, 0.55+/- 0.05 N-M.
    Figure 17. Quick connect screw installation (Compute node)
    Quick connect screw installation (Compute node)
  7. Replace the putty pads on the top side and the bottom side of the OSFP module conduction plate.
    Attention
    Putty pad cannot be reused. Whenever a component is removed, putty pads must be replaced with new ones before reinstalling the component.
    Figure 18. OSFP module conduction plate putty pads replacement
    OSFP module conduction plate putty pads replacement

    1 Conduction plate top putty pad

    2 Conduction plate bottom putty pad

Make sure to follow Gap pad/putty pad replacement guidelines.

  1. Install the OSFP module conduction plate onto the water loop.
    Screw TypeScrewdriver Type
    1 M3x5 screw (x3)Phillips #1 head screwdriver
    2 M3 screw (x2)T10 screwdriver
    Figure 19. Installing the OSFP module conduction plate
    the OSFP module conduction plate
  2. Install the two Hex screws to the OSFP module with a 4.5 mm hex head screwdriver.
    Figure 20. OSFP module conduction plate Hex screws installation
    OSFP module conduction plate Hex screws installation
After you finish
  1. Install the OSFP module. See Install the OSFP module.

  2. Install the drive cage. See Install a drive cage assembly.

  3. Install the MCIO cables. Follow the guidance and routing information in Internal cable routing.

  4. Install the bus bar. See Install the bus bar.

  5. Install the M.2 backplane assembly. See Install the M.2 backplane assembly.

  6. Install the memory modules. See Install a memory module.

  7. Install the DIMM comb. See Install a DIMM comb.

  8. Install the cross braces. See Install the cross braces.

  9. Install the tray cover. See Install the tray cover.

  10. Install the tray into the enclosure. See Install a DWC tray in the enclosure.

  11. Connect all required external cables to the solution.
    Note
    Use extra force to connect QSFP cables to the solution.
  12. Check the power LED on each node to make sure it changes from fast blink to slow blink to indicate all nodes are ready to be powered on.

Demo video

Watch the procedure on YouTube