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Remove the processor socket protective film

This task has instructions for removing the processor socket protective film.

About this task

Required tools

Make sure you have the required tools listed below in hand to properly replace the component.

  • SD665-N V3 Water Loop Service Kit (The water loop carrier in the Service Kit is reusable, it is recommended to keep it at the facility where the server operates for future replacement needs.)

  • SD665-N V3 Water Loop Putty Pad Kit

  • SD665-N V3 OSFP Putty Pad Kit

    Putty pad cannot be reused. Whenever the water loop is removed, putty pads must be replaced with new ones before reinstalling the water loop.

  • Drive gap pad or putty pad kits according to the drives installed in the tray. See their respective replacement procedures for more information.

  • Screws and screwdrivers

    Prepare the following screwdrivers to ensure you can install and remove corresponding screws properly.
    Screw TypeScrewdriver Type
    Hex screw6 mm hex head screwdriver
    Torx T10 screwTorx T10 head screwdriver
    Phillips #1 screwPhillips #1 head screwdriver
    Phillips #2 screwPhillips #2 head screwdriver
Attention

  • Read Installation Guidelines and Safety inspection checklist to ensure that you work safely.

  • Turn off the corresponding DWC tray that you are going to perform the task on.

  • Disconnect all external cables from the enclosure.

  • Use extra force to disconnect QSFP cables if they are connected to the solution.

  • To avoid damaging the water loop, always use the water loop carrier when removing, installing or folding the water loop.

Procedure

Note
Depending on the model, your solution might look slightly different from the illustration.

  1. Make preparations for this task.
    1. Remove the tray from the enclosure. See Remove a DWC tray from the enclosure.
    2. Remove the tray cover. See Remove the tray cover.
    3. Remove the cross braces. See Remove the cross braces.
    4. Remove the DIMM comb. See Remove a DIMM comb.
    5. Remove memory modules. See Remove a memory module.
    6. Remove the M.2 backplane assembly. See Remove the M.2 backplane assembly.
    7. Remove the bus bar. See Remove the bus bar.
    8. Remove the MCIO cables. Follow the guidance and routing information in Internal cable routing.
    9. Remove the drive cage. See Remove a drive cage assembly.
    10. Remove the OSFP module. See Remove the OSFP module.
  2. Remove the two Hex screws from the OSFP module with a 4.5 mm hex head screwdriver.
    Figure 1. OSFP module conduction plate Hex screws removal
    OSFP module conduction plate Hex screws removal
  3. Remove the OSFP module conduction plate. With alcohol cleaning pads, wipe of any remaining putty pads from the conduction plate.
    Screw TypeScrewdriver Type
    1 M3x5 screw (x3)Phillips #1 head screwdriver
    2 M3 screw (x2)T10 screwdriver
    Figure 2. OSFP module conduction plate removal
    Removing the OSFP module conduction plate
  4. Remove the five Torx T10 screws to loosen the quick connect.
    Note
    For reference, the torque required for the screws to be fully tightened/removed is 5.0+/- 0.5 lbf-in, 0.55+/- 0.05 N-M.
    Figure 3. Quick connect screw removal (Compute node)
    Quick connect screw removal
  5. Remove water loop screws and quick connect screws (14x Torx T10 screws per node) with a torque screwdriver set to the proper torque.
    Note

    • For reference, the torque required for the screws to be fully tightened/removed is 5.0+/- 0.5 lbf-in, 0.55+/- 0.05 N-M.

    • When removing the 1 VR cold plate screws (x2), remove the washers, too. Make sure to keep the washers for future use.

      Figure 4. VR cold plate screws with washer
      VR cold plate screws with washer
    Figure 5. Water loop screw removal

    1 VR cold plate screws (x2)


  6. Remove processor cold plate screws (12x Torx T20 screws per node). Follow the screw sequence specified on the processor cold plate label and loosen the screws with a general screwdriver. Fully loosen each screw; then, proceed to the next screw.
    Note
    For reference, the torque required for the screws to be fully tightened/removed is 1.12-1.46 newton-meters, 10-13 inch-pounds
    Figure 6. Processor cold plate label

    Fully loosen each screw in this order: 6 > 5 > 4 > 3 > 2 > 1


    Processor cold plate label
    Figure 7. Processor cold plate removal
    Processor cold plate removal
  7. Orient the water loop carrier with the guide pin; then, gently put the water loop carrier down and ensure it is seated firmly on the water loop.
    Figure 8. Water loop carrier installation (Compute node)
    Water loop carrier installation (Compute node)
  8. Tighten water loop carrier screws (x12 Phillips #2 screws).
    Note
    Select screw holes marked as R on the rear of the shipping bracket.
    Figure 9. Water loop carrier screws installation (Compute node)
    Water loop carrier screws installation (Compute node)
  9. Rotate the latch on the water loop carrier to separate the water loop from processors.
    Figure 10. Separate water loop from processor
    Separate water loop from processor
  10. Carefully rotate the water loop so one half is sitting on top of the other half.
    Figure 11. Folding the water loop
    Folding the water loop
  11. Remove the processor socket protective film from the processor socket.
    Attention
    Processor socket protective film can only be installed in processor socket 2.
    Figure 12. Processor socket protective film removal
    Processor socket protective film removal
  12. With an alcohol cleaning pad, wipe off any remaining thermal grease from the water loop and from the top of the processor.
After you finish

If you are instructed to return the component or optional device, follow all packaging instructions, and use any packaging materials for shipping that are supplied to you.