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Remove the M.2 backplane assembly

Use this information to remove the M.2 backplane assembly.

About this task

Make sure you have the following kits to properly replace the component:

  • SD665 V3 Conduction Plate Parts

  • SD665 V3 Miscellaneous Parts Kit

  • M.2 Putty Pad Kit

    Putty pad cannot be reused. Whenever a component is removed, putty pads must be replaced with new ones before reinstalling the component.

Attention

  • Read Installation Guidelines and Safety inspection checklist to ensure that you work safely.

  • Turn off the corresponding DWC tray that you are going to perform the task on.

  • Disconnect all external cables from the enclosure.

  • Use extra force to disconnect QSFP cables if they are connected to the solution.

Procedure

  1. Make preparations for this task.
    1. Remove the tray from the enclosure. See Remove a DWC tray from the enclosure.
    2. Remove the tray cover. See Remove the tray cover.
    3. Remove the cross braces. See Remove the cross braces.
  2. Disconnect the cable from the system board.
    Figure 1. M.2 backplane assembly cable removal
    M.2 backplane assembly cable removal
  3. Remove the M.2 backplane assembly.
    1. Remove the six screws.
    2. Remove the M.2 backplane assembly out from the node.
    3. Disconnect the cable from the M.2 backplane assembly.
    Figure 2. M.2 backplane assembly removal
    M.2 backplane assembly removal
  4. (Optional) If you are removing the water loop, remove the M.2 backplane cold plate.
    1. Unfasten the two screws.
    2. Remove the M.2 backplane cold plate from the processor cold plate.
    Figure 3. M.2 backplane cold plate removal
    Removing the M.2 cold plate
After you finish

If you are instructed to return the component or optional device, follow all packaging instructions, and use any packaging materials for shipping that are supplied to you.

Demo video

Watch the procedure on YouTube