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Remove the system board

Use this information to remove the system board.

About this task

Important
Before powering off the server, make sure to read the GPU power capping value following the instructions in GPU power capping settings (trained technician only).

Required tools

Make sure you have the required tools listed below in hand to properly replace the component.

  • SD665-N V3 Water Loop Service Kit (The water loop carrier in the Service Kit is reusable, it is recommended to keep it at the facility where the server operates for future replacement needs.)

  • SD665-N V3 Water Loop Putty Pad Kit

  • SD665-N V3 OSFP Putty Pad Kit

  • VR 2.5 mm Putty Pad

  • Shielding cables

    Putty pad cannot be reused. Whenever the water loop is removed, putty pads must be replaced with new ones before reinstalling the water loop.

  • Drive gap pad or putty pad kits according to the drives installed in the tray. See their respective replacement procedures for more information.

  • Screws and screwdrivers

    Prepare the following screwdrivers to ensure you can install and remove corresponding screws properly.
    Screwdriver TypeScrew Type
    Hex screw (GPU node water loop)6 mm hex head screwdriver
    Hex screw (OSFP module conduction plate)4.5 mm hex head screwdriver
    Torx T10 head screwdriverTorx T10 screw
    Torx T20 head screwdriverTorx T20 screw
    Phillips #1 head screwdriverM3 screw
    Phillips #2 head screwdriverPhillips #2 screw
    3/16" hex head screwdriverM3 screw
Attention

  • Read Installation Guidelines and Safety inspection checklist to ensure that you work safely.

  • Turn off the corresponding DWC tray that you are going to perform the task on.

  • Disconnect all external cables from the enclosure.

  • Use extra force to disconnect QSFP cables if they are connected to the solution.

  • To avoid damaging the water loop, always use the water loop carrier when removing, installing or folding the water loop.

  • When removing the system board, do not remove the shielding cables (1) from the system board.



Procedure

  1. Make preparations for this task.
    1. Remove the tray from the enclosure. See Remove a DWC tray from the enclosure.
    2. Remove the tray cover. See Remove the tray cover.
    3. Remove the cross braces. See Remove the cross braces.
    4. Remove the DIMM comb. See Remove a DIMM comb.
    5. Remove memory modules. See Remove a memory module.
    6. Remove the M.2 backplane assembly. See Remove the M.2 backplane assembly.
    7. Remove the bus bar. See Remove the bus bar.
    8. Remove the MCIO cables. Follow the guidance and routing information in Internal cable routing.
    9. Remove the drive cage. See Remove a drive cage assembly.
    10. Remove the OSFP module. See Remove the OSFP module.
  2. Remove the processors, and carefully rotate the water loop so one half is sitting on top of the other half. See Remove a processor.
  3. Remove the power distribution board. See Remove the power distribution board.
  4. Remove the two KVM screws from the front of the node with a torque screwdriver set to the proper torque.
    Note
    For reference, the torque required for the screws to fully tightened/removed is 1.3+/-0.5 lb-in, 0.15+/- 0.05 N-M.
    Figure 1. KVM screws removal
    KVM screws removal
  5. Remove the two M3 screws to remove the VR conduction plate out of the system board.
    Note
    Keep the VR conduction plate for future use.
    Figure 2. VR conduction plate removal
    VR conduction plate removal
  6. Remove eight M3 screws per node on the system board with a 3/16" hex head screwdriver set to the proper torque.
    Note
    For reference, the torque required for the screws to be fully tightened/removed is 5.0+/- 0.5 lbf-in, 0.55+/- 0.05 N-M.
    Figure 3. System board screws removal
    System board screws removal
  7. Carefully hold the guide pin and tilt the system board at an angle; then, gently slide and lift the system board backwards to remove the system board from the node.
    Note
    Avoid touching the connectors on the system board. Be careful not to damage any surrounding components inside the node.
    Figure 4. System board removal
    System board removal
After you finish

If you are instructed to return the component or optional device, follow all packaging instructions, and use any packaging materials for shipping that are supplied to you.

Important
Before you return the system board, make sure that you install the processor socket dust covers from the new system board. To replace a processor socket dust cover:

  1. Take a dust cover from the processor socket assembly on the new system board and orient it correctly above the processor socket assembly on the removed system board.

  2. Gently press down the dust cover legs to the processor socket assembly, pressing on the edges to avoid damage to the socket pins. You might hear a click on the dust cover is securely attached.

  3. Make sure that the dust cover is securely attached to the processor socket assembly.

If you need to disassemble the system board, follow the instructions below:
Attention
You can only disassemble the system board for recycle. Do not disassemble it for any other purposes.

  1. Remove the guide pin out of the system board.

    Figure 5. Guide pin removal
    Guide pin removal

  2. Recycle the unit in compliance with local regulations.

Demo video

Watch the procedure on YouTube