Thermal rules for server without DWCM

This topic provides thermal rules for the server without a Direct Water Cooling Module (DWCM).

Abbreviations used in tables below are defined as follows:

Max.Temp.: Maximum ambient temperature at sea level
FIO = riser 5 + front OCP
4LP = riser 3/4
S/S: SAS/SATA
Any: AnyBay
E: entry
S: standard
P: performance
SW: single-wide
DW: double-wide
NA: not applicable
Y: yes
N: no

Note

Performance heat sinks and performance fans are needed for the server having 195 W processors 6434/6434H/6534 or rear 4LP riser.
Standard heat sinks and standard fans are needed for the server having 165 W 5515+ processors.
Performance heat sinks are needed for the server having a GPU adapter installed on the front riser.
Performance fans are needed for the server having any of the following components:
- front PCIe and OCP adapters
- OCP module installed in the chassis with 12 x 3.5-inch front drives
- rear 7mm NVMe drives installed in the chassis with 12 x 3.5-inch front drives
- internal CFF RAID/HBA/expander
- parts with active optical cable (AOC) installed in storage configurations
- ThinkSystem 96GB TruDDR5 4800MHz (2Rx4) RDIMM
- ThinkSystem 128GB TruDDR5 4800MHz (4Rx4) 3DS RDIMM v1
- ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM v1
- the following special network cards installed in storage configurations
  - Mellanox ConnectX-6 HDR100 IB/100GbE VPI 1-port x16 PCIe 3.0 HCA w/ Tall Bracket L1/SBB with Active Fiber cables
  - Mellanox ConnectX-6 HDR100 IB/100GbE VPI 2-port x16 PCIe 3.0 HCA w/ Tall Bracket L1/SBB with Active Fiber cables
  - Mellanox ConnectX-6 HDR IB/200GbE Single Port x16 PCIe Adapter w/ Tall Bracket with Active Fiber cables
  - Mellanox MCX623106AC-CDAT Dx 100GbE QSFP56 2-port PCIe NIC -CSP I4
  - ThinkSystem Mellanox ConnectX-6 Dx 100GbE QSFP56 2-port PCIe Ethernet Adapter with Active Fiber cables
  - ThinkSystem NVIDIA BlueField-2 25GbE SFP56 2-Port PCIe Ethernet DPU w/BMC & Crypto
  - ThinkSystem NVIDIA ConnectX-7 NDR400 OSFP 1-port PCIe Gen5 Adapter with Active Fiber cables
  - ThinkSystem NVIDIA ConnectX-7 NDR200/HDR QSFP112 2-port PCIe Gen5 x16 InfiniBand Adapter with Active Fiber cables
  - ThinkSystem Broadcom 57508 100GbE QSFP56 2-port PCIe 4 Ethernet Adapter V2 with Active Fiber cables
  - ThinkSystem Broadcom 57454 10GBASE-T 4-port OCP Ethernet Adapter
  - ThinkSystem Broadcom 57416 10GBASE-T 2-port OCP Ethernet Adapter
  - ThinkSystem Broadcom 57508 100GbE QSFP56 2-Port OCP Ethernet Adapter
ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM v1 is supported only on servers installed with the following components at a maximum ambient temperature of 25°C:
- 8 x 2.5"/16 x 2.5"/8 x 3.5" front drive bay
- processors with TDP less than or equal to 250 W
- 2U entry or standard heat sinks
- performance fans
When ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM v1 is installed, the server supports a maximum of six HHHL GPU adapters in slot 1/2/4/5/7/8, and does not support FHFL GPU adapters.
The ambient temperature is limited to 30°C or lower when any of the following types of RDIMMs are used:
- 5600 MHz RDIMMs with capacity greater than or equal to 96 GB
- ThinkSystem 96GB TruDDR5 4800MHz (2Rx4) RDIMM
- ThinkSystem 128GB TruDDR5 4800MHz (4Rx4) 3DS RDIMM v1
- 4800 MHz 256 GB RDIMMs (except ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM v1)

Standard configurations

This section provides thermal information for standard configurations.

Front drive bays	Max. Temp.	CPU TDP (watts)	Heat sink	Air baffle	Fan type	Max. DIMM Qty.
8 x 2.5" 16 x 2.5" 8 x 3.5"	45°C	125 <= TDP <= 185	T-shape (P)	S	P	32
	40°C	<= 205	T-shape (P)	S	P	32
	35°C	125 <= TDP <= 185	2U (E)	S	S	32
	35°C	<= 250	2U (S)	S	S	32
	35°C	270 <= TDP <= 330	T-shape (P)	S	P	32
	30°C	350	T-shape (P)	S	P	32

Note

The DIMM supporting has the following conditions:
- When the capacity of each RDIMM is less than or equal to 64 GB, standard fans are used.
- When the capacity of each RDIMM is greater than 64 GB, performance fans are used.
The maximum ambient temperatures of 45°C and 40°C are supported under the following conditions:
- The capacity of each RDIMM must be less than or equal to 64 GB.
- The server supports only low profile PCIe cards with performance dropping.
- The following processors are not used:
  - 195 W processors 6434/6434H/6534
  - 165 W processor 5515+

Storage configurations with SPR processors

This section provides thermal information for storage configurations with 4th Gen (Sapphire Rapids, SPR) processors.

Front drive bays	Middle drive bays	Rear drive bays	Max. Temp.	CPU TDP (watts)	Heat sink	Air baffle	Fan type	Max. DIMM Qty.
24 x 2.5"	NA	NA	30°C	125 <= TDP <= 185	2U (E)	S	S	32
			30°C	195 <= TDP <= 205	2U (S)	S	S	32
			30°C	225 <= TDP <= 250	2U (S)	S	P	32
			30°C	270 <= TDP <= 330	T-shape (P)	S	P	32
			25°C	350	T-shape (P)	S	P	32
	NA	4 x 2.5" S/S 2 x 3.5" S/S 4 x 2.5" NVMe	30°C	<= 250	T-shape (P)	S	P	32
	NA	4 x 2.5" S/S 2 x 3.5" S/S 4 x 2.5" NVMe	25°C	270 <= TDP <= 300	T-shape (P)	S	P	32
	8 x 2.5" NVMe	NA	30°C	<= 250	T-shape (P)	NA	P	32
	8 x 2.5" NVMe	NA	25°C	270 <= TDP <= 300	T-shape (P)	NA	P	32
	8 x 2.5" S/S 4 x 3.5" S/S	4 x 2.5" S/S 8 x 2.5" S/S	30°C	<= 250	T-shape (P)	NA	P	32
	8 x 2.5" S/S 4 x 3.5" S/S	4 x 2.5" S/S 8 x 2.5" S/S	25°C	270 <= TDP <= 300	T-shape (P)	NA	P	32
	8 x 2.5" NVMe	4 x 2.5" NVMe	25°C	<= 300	T-shape (P)	NA	P	32
12 x 3.5"	NA	NA	30°C	125 <= TDP <= 185	2U (E)	S	S	32
			30°C	195 <= TDP <= 205	2U (S)	S	S	32
			30°C	225 <= TDP <= 250	2U (S)	S	P	32
			30°C	270 <= TDP <= 330	T-shape (P)	S	P	32
			25°C	350	T-shape (P)	S	P	32
	NA	2 x 3.5" S/S 4 x 3.5" S/S 4 x 2.5" S/S 4 x 2.5" NVMe	30°C	<= 250	T-shape (P)	S	P	32
	NA	2 x 3.5" S/S 4 x 3.5" S/S 4 x 2.5" S/S 4 x 2.5" NVMe	25°C	270 <= TDP <= 300	T-shape (P)	S	P	32
	8 x 2.5" NVMe	NA	30°C	<= 250	T-shape (P)	NA	P	32
	8 x 2.5" NVMe	NA	25°C	270 <= TDP <= 300	T-shape (P)	NA	P	32
	4 x 3.5" S/S	4 x 3.5" S/S 4 x 2.5" S/S	30°C	<= 250	T-shape (P)	NA	P	32
	4 x 3.5" S/S	4 x 3.5" S/S 4 x 2.5" S/S	25°C	270 <= TDP <= 300	T-shape (P)	NA	P	32

Note

The DIMM supporting has the following conditions:
- When the capacity of each RDIMM is less than or equal to 32 GB, standard fans are used.
- When the capacity of each RDIMM is greater than 32 GB, performance fans are used.
- The ambient temperature is limited to 25°C or lower when ThinkSystem 128GB TruDDR5 4800MHz (4Rx4) 3DS RDIMM v1 is used in 8 x 2.5" AnyBay + 16 x 2.5" SAS/SATA, 16 x 2.5" AnyBay + 8 x 2.5" SAS/SATA, or 24 x 2.5" AnyBay configurations.
- The ambient temperature is limited to 30°C or lower when ThinkSystem 128GB TruDDR5 4800MHz (4Rx4) 3DS RDIMM v1 is used in 12 x 3.5" configurations under the following conditions:
  - No middle or rear drive bay is installed.
  - Standard or Entry heat sinks are used.
  - Processor TDP is less than or equal to 250 W.
- The ambient temperature is limited to 25°C or lower when ThinkSystem 96GB TruDDR5 4800MHz (2Rx4) RDIMM is installed in the following configurations:
  - 12 x 3.5" configurations including processors with TDP less than or equal to 300 W
  - 12 x 3.5" + middle/rear drive bay configurations including processors with TDP less than or equal to 270 W
- ThinkSystem 96GB TruDDR5 4800MHz (2Rx4) RDIMM is not supported in 12 x 3.5" configurations including processors with TDP greater than 300 W.
For the chassis with 12 x 3.5-inch front drives, a part with AOC is not supported in slot 3.
For better performance, it is not recommended to block the air vent on the top cover of a server with storage configuration.
When the ambient temperature is 30°C, Gen 5 NVMe rear or middle drive bays do not support the drives larger than 3.84 TB.
The ambient temperature is limited to 25°C or lower when the following NVMe SSDs are installed in the front 12 x 3.5" SAS/SATA + middle 8 x 2.5" NVMe or front 12 x 3.5" SAS/SATA + rear 4 x 2.5" NVMe configuration:
- ThinkSystem 2.5" U.2 P5336 61.44TB Read Intensive NVMe PCIe 4.0 x4 HS SSD
- ThinkSystem 2.5" U.2 P5336 30.72TB Read Intensive NVMe PCIe 4.0 x4 HS SSD
- ThinkSystem 2.5" U.2 P5336 15.36TB Read Intensive NVMe PCIe 4.0 x4 HS SSD

Storage configurations with EMR processors

This section provides thermal information for storage configurations with 5th Gen (Emerald Rapids, EMR) processors.

Front drive bays	Middle drive bays	Rear drive bays	Max. Temp.	CPU TDP (watts)	Heat sink	Air baffle	Fan type	Max. DIMM Qty.
24 x 2.5"	NA	NA	30°C	125 <= TDP <= 185	2U (E)	S	P	32
			30°C	185 < TDP <= 250	2U (S)	S	P	32
			30°C	270 <= TDP <= 330	T-shape (P)	S	P	32
			25°C	350	T-shape (P)	S	P	32
	NA	4 x 2.5" S/S 2 x 3.5" S/S 4 x 2.5" NVMe	30°C	<= 250	T-shape (P)	S	P	32
	NA	4 x 2.5" S/S 2 x 3.5" S/S 4 x 2.5" NVMe	25°C	270 <= TDP <= 300	T-shape (P)	S	P	32
	8 x 2.5" NVMe	NA	30°C	<= 250	T-shape (P)	NA	P	32
	8 x 2.5" NVMe	NA	25°C	270 <= TDP <= 300	T-shape (P)	NA	P	32
	8 x 2.5" S/S 4 x 3.5" S/S	4 x 2.5" S/S 8 x 2.5" S/S	30°C	<= 250	T-shape (P)	NA	P	32
	8 x 2.5" S/S 4 x 3.5" S/S	4 x 2.5" S/S 8 x 2.5" S/S	25°C	270 <= TDP <= 300	T-shape (P)	NA	P	32
	8 x 2.5" NVMe	4 x 2.5" NVMe	25°C	<= 300	T-shape (P)	NA	P	32
12 x 3.5"	NA	NA	30°C	125 <= TDP <= 185	2U (E)	S	P	32
			30°C	185 < TDP <= 250	2U (S)	S	P	32
			30°C	270 <= TDP <= 330	T-shape (P)	S	P	32
			25°C	350	T-shape (P)	S	P	32
	NA	2 x 3.5" S/S 4 x 3.5" S/S 4 x 2.5" S/S 4 x 2.5" NVMe	30°C	<= 250	T-shape (P)	S	P	32
	NA	2 x 3.5" S/S 4 x 3.5" S/S 4 x 2.5" S/S 4 x 2.5" NVMe	25°C	270 <= TDP <= 300	T-shape (P)	S	P	32
	8 x 2.5" NVMe	NA	30°C	<= 250	T-shape (P)	NA	P	32
	8 x 2.5" NVMe	NA	25°C	270 <= TDP <= 300	T-shape (P)	NA	P	32
	4 x 3.5" S/S	4 x 3.5" S/S 4 x 2.5" S/S	30°C	<= 250	T-shape (P)	NA	P	32
	4 x 3.5" S/S	4 x 3.5" S/S 4 x 2.5" S/S	25°C	270 <= TDP <= 300	T-shape (P)	NA	P	32

Note

The DIMM supporting has the following conditions:
- The ambient temperature is limited to 25°C or lower when ThinkSystem 128GB TruDDR5 4800MHz (4Rx4) 3DS RDIMM v1 is used in 8 x 2.5" AnyBay + 16 x 2.5" SAS/SATA, 16 x 2.5" AnyBay + 8 x 2.5" SAS/SATA, or 24 x 2.5" AnyBay configurations.
- The ambient temperature is limited to 30°C or lower when ThinkSystem 128GB TruDDR5 4800MHz (4Rx4) 3DS RDIMM v1 is used in 12 x 3.5" configurations under the following conditions:
  - No middle or rear drive bay is installed.
  - Standard or Entry heat sinks are used.
  - Processor TDP is less than or equal to 250 W.
For the chassis with 12 x 3.5-inch front drives, a part with AOC is not supported in slot 3.
In 12 x 3.5" configurations, the server supports the maximum temperature of 30°C for processors with TDP greater than 300 W and less than or equal to 330 W and 25°C for 350 W processors only when the capacity of DIMM is less than or equal to 48 GB.
For better performance, it is not recommended to block the air vent on the top cover of a server with storage configuration.
When the ambient temperature is 30°C or higher, Gen 5 NVMe rear or middle drive bays do not support the drives larger than 3.84 TB.
The ambient temperature is limited to 25°C or lower when the following NVMe SSDs are installed in the front 12 x 3.5" SAS/SATA + middle 8 x 2.5" NVMe or front 12 x 3.5" SAS/SATA + rear 4 x 2.5" NVMe configuration:
- ThinkSystem 2.5" U.2 P5336 61.44TB Read Intensive NVMe PCIe 4.0 x4 HS SSD
- ThinkSystem 2.5" U.2 P5336 30.72TB Read Intensive NVMe PCIe 4.0 x4 HS SSD
- ThinkSystem 2.5" U.2 P5336 15.36TB Read Intensive NVMe PCIe 4.0 x4 HS SSD

GPU configurations without FIO

This section provides thermal information for GPU configurations without FIO.

Single-wide GPU: NVIDIA A2, T1000, T400, L4
Double-wide GPU: NVIDIA A16, A30, A40, A100, A800, H100, H800, L40, L40S, RTX A2000, RTX A4500, RTX A6000, RTX 6000 Ada; AMD Instinct MI210

Front drive bays	Max. Temp.	CPU TDP (watts)	Heat sink	Air baffle	Fan type	Max. GPU Qty.		Max. DIMM Qty.
Front drive bays	Max. Temp.	CPU TDP (watts)	Heat sink	Air baffle	Fan type	SW	DW	Max. DIMM Qty.
8 x 2.5"	30°C	125 <= TDP <= 185	2U (E)	S	P	8	NA	32
	30°C	225 <= TDP <= 250	2U (S)	S	P	8	NA	32
	30°C	270 <= TDP <= 350	T-shape (P)	S	P	8	NA	32
	30°C	<= 350	T-shape (P)	GPU	P	NA	3	32
8 x 3.5" 16 x 2.5"	30°C	125 <= TDP <= 185	2U (E)	S	P	8	NA	32
	30°C	225 <= TDP <= 250	2U (S)	S	P	8	NA	32
	30°C	270 <= TDP <= 300	T-shape (P)	S	P	8	NA	32
	30°C	<= 300	T-shape (P)	GPU	P	NA	3	32
	25°C	300 < TDP <= 350	T-shape (P)	S	P	8	NA	32
	25°C	300 < TDP <= 350	T-shape (P)	GPU	P	NA	3	32
24 x 2.5"	25°C	125 <= TDP <= 185	2U (E)	S	P	6	NA	32
	25°C	225 <= TDP <= 250	2U (S)	S	P	6	NA	32
	25°C	270 <= TDP <= 300	T-shape (P)	S	P	6	NA	32
	25°C	<= 300	T-shape (P)	GPU	P	NA	2	32

Note

For the chassis with 16 x 2.5-inch front drives, a maximum of two A40, H100, H800, or L40S GPU adapters are supported in PCIe slot 2 and slot 5 at a maximum ambient temperature of 30°C.
A40 is not supported by the chassis with 24 x 2.5-inch front drives.
A maximum of three RTX A2000 and RTX 6000 Ada GPU adapters are supported by the chassis with 24 x 2.5-inch front drives.

GPU Configurations with FIO

This section provides thermal information for the GPU configurations with FIO.

Single-wide GPU: NVIDIA A2, T1000, T400, L4
Double-wide GPU: NVIDIA A16, A30, A40, A100, A800, H100, H800, L40, L40S, RTX A2000, RTX A4500, RTX A6000, RTX 6000 Ada; AMD Instinct MI210

Front drive bays	Max. Temp.	CPU TDP (watts)	Heat sink	Air baffle	Fan type	Max. GPU Qty.			Max. DIMM Qty.
Front drive bays	Max. Temp.	CPU TDP (watts)	Heat sink	Air baffle	Fan type	T1000/T400	A2/L4	DW	Max. DIMM Qty.
8 x 2.5" + FIO	30°C	<= 300	T-shape (P)	S	P	8	10	NA	32
	25°C	300 < TDP <= 350	T-shape (P)	S	P	8	10	NA	32
	30°C	<= 300	T-shape (P)	GPU	P	NA	NA	2	32
	25°C	300 < TDP <= 350	T-shape (P)	GPU	P	NA	NA	2	32
16 x 2.5" + FIO	25°C	<= 300	T-shape (P)	S	P	8	10	NA	32
16 x 2.5" + FIO	25°C	<= 300	T-shape (P)	GPU	P	NA	NA	2	32

Note

The front riser (riser 5) supports only passive SW GPU adapters.
A40 is not supported in the 16 x 2.5" + FIO GPU configurations.

None-GPU Configurations with FIO or 4LP

This section provides thermal information for non-GPU configurations with FIO or rear 4LP riser.

Front drive bays	Max. Temp.	CPU TDP (watts)	Heat sink	Air baffle	Fan type	Max. DIMM Qty.
8 x 2.5" + FIO	35°C	125 <= TDP <= 185	2U (E)	S	P	32
	35°C	205 <= TDP <= 250	2U (S)	S	P	32
	35°C	270 <= TDP <= 330	T-shape (P)	S	P	32
	30°C	350	T-shape (P)	S	P	32
16 x 2.5" + FIO	30°C	125 <= TDP <= 185	2U (E)	S	P	32
	30°C	205 <= TDP <= 250	2U (S)	S	P	32
	30°C	270 <= TDP <= 330	T-shape (P)	S	P	32
	25°C	350	T-shape (P)	S	P	32
8 x 2.5" + 4LP 16 x 2.5" + 4LP	35°C	<= 330	T-shape (P)	S	P	32
8 x 2.5" + 4LP 16 x 2.5" + 4LP	30°C	350	T-shape (P)	S	P	32

Note

The ambient temperature must be limited to 25°C or lower when ThinkSystem 128GB TruDDR5 4800MHz (4Rx4) 3DS RDIMM v1 is installed in the 8 x 2.5" SAS/SATA + 8 x 2.5" AnyBay + FIO configuration or 16 x 2.5" AnyBay + FIO configuration.

Configuration with 2U winged heat sinks

This section provides thermal information for the currently available configuration with 2U winged heat sinks.

Front drive bays	Max. Temp.	CPU	Air baffle	Fan type	Max. DIMM Qty.
8 x 2.5" NVMe Gen5	30°C	6558Q	NA	P	32 x 5600 MHz 16 GB DIMM

Note

The 8 x 2.5" backplane is installed in the position of backplane 2. For the position of backplane 2, see Install the 2.5-inch front drive backplane.
For the 8 x 2.5" NVMe configuration, the drive capacity must be less than or equal to 7.68 TB.
For other configuration requests with 2U winged heat sink for 6558Q, 6458Q or 8470Q liquid cooling processors, reach Lenovo sales representative to investigate through Lenovo special bid process.

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Thermal rules for server without DWCM

Standard configurations​

Storage configurations with SPR processors​

Storage configurations with EMR processors​

GPU configurations without FIO​

GPU Configurations with FIO​

None-GPU Configurations with FIO or 4LP​

Configuration with 2U winged heat sinks​

Standard configurations

Storage configurations with SPR processors

Storage configurations with EMR processors

GPU configurations without FIO

GPU Configurations with FIO

None-GPU Configurations with FIO or 4LP

Configuration with 2U winged heat sinks