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Thermal rules for server with DWCM

This topic provides thermal rules for the server with a Direct Water Cooling Module (DWCM).

Abbreviations used in tables below are defined as follows:
  • Max.Temp.: Maximum ambient temperature at sea level

  • FIO = riser 5 + front OCP

  • 4LP = riser 3/4

  • S/S: SAS/SATA

  • Any: AnyBay

  • E: entry

  • S: standard

  • P: performance

  • SW: single-wide

  • DW: double-wide

  • NA: not applicable

  • Y: yes

  • N: no

Note
  • Performance fans are needed for the server having any of the following components:
    • front PCIe and OCP adapters

    • OCP module installed in the chassis with 12 x 3.5-inch front drives

    • rear 7mm NVMe drives installed in the chassis with 12 x 3.5-inch front drives

    • internal CFF RAID/HBA/expander

    • parts with active optical cable (AOC) installed in storage configurations

    • ThinkSystem 96GB TruDDR5 4800MHz (2Rx4) RDIMM
    • ThinkSystem 128GB TruDDR5 4800MHz (4Rx4) 3DS RDIMM v1

    • ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM v1

    • the following special network cards installed in storage configurations
      • Mellanox ConnectX-6 HDR100 IB/100GbE VPI 1-port x16 PCIe 3.0 HCA w/ Tall Bracket L1/SBB with Active Fiber cables

      • Mellanox ConnectX-6 HDR100 IB/100GbE VPI 2-port x16 PCIe 3.0 HCA w/ Tall Bracket L1/SBB with Active Fiber cables

      • Mellanox ConnectX-6 HDR IB/200GbE Single Port x16 PCIe Adapter w/ Tall Bracket with Active Fiber cables

      • Mellanox MCX623106AC-CDAT Dx 100GbE QSFP56 2-port PCIe NIC -CSP I4

      • ThinkSystem Mellanox ConnectX-6 Dx 100GbE QSFP56 2-port PCIe Ethernet Adapter with Active Fiber cables

      • ThinkSystem NVIDIA BlueField-2 25GbE SFP56 2-Port PCIe Ethernet DPU w/BMC & Crypto

      • ThinkSystem NVIDIA ConnectX-7 NDR400 OSFP 1-port PCIe Gen5 Adapter with Active Fiber cables

      • ThinkSystem NVIDIA ConnectX-7 NDR200/HDR QSFP112 2-port PCIe Gen5 x16 InfiniBand Adapter with Active Fiber cables

      • ThinkSystem Broadcom 57508 100GbE QSFP56 2-port PCIe 4 Ethernet Adapter V2 with Active Fiber cables

      • ThinkSystem Broadcom 57454 10GBASE-T 4-port OCP Ethernet Adapter

      • ThinkSystem Broadcom 57416 10GBASE-T 2-port OCP Ethernet Adapter

      • ThinkSystem Broadcom 57508 100GbE QSFP56 2-Port OCP Ethernet Adapter

  • The ambient temperature is limited to 30°C or lower when any of the following types of RDIMMs are used:
    • 5600 MHz RDIMMs with capacity greater than or equal to 96 GB

    • ThinkSystem 96GB TruDDR5 4800MHz (2Rx4) RDIMM
    • ThinkSystem 128GB TruDDR5 4800MHz (4Rx4) 3DS RDIMM v1

    • 4800 MHz 256 GB RDIMMs (except ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM v1)

Standard configurations

This section provides thermal information for standard configurations with a DWCM.

Front drive baysMax. Temp.CPU TDP (watts)Air baffleFan typeMax. DIMM Qty.

8 x 2.5"

16 x 2.5"

8 x 3.5"

35°CAll supportedSS32
Note

The ambient temperature is limited to 25°C when ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM v1 is used.

Storage configurations

This section provides thermal information for storage configurations with a DWCM.

Front drive baysMiddle drive baysRear drive baysMax. Temp.Air baffleFan typeMax. DIMM Qty.

16 x 2.5" S/S + 8 x 2.5" Any

8 x 2.5" S/S + 16 x 2.5" Any

24 x 2.5" S/S

24 x 2.5" Any

NA

NA

35°CSS32

NA

4 x 2.5" S/S

2 x 3.5" S/S

35°CSP32

8 x 2.5" NVMe

NA

30°C

NA

P32

8 x 2.5" S/S

4 x 3.5" S/S

4 x 2.5" S/S

8 x 2.5" S/S

35°C

NA

P32

24 x 2.5" S/S

24 x 2.5" Any

NA

4 x 2.5" NVMe

30°CSP32

24 x 2.5" NVMe

8 x 2.5" NVMe

4 x 2.5" NVMe

30°C

NA

P32

12 x 3.5" S/S

12 x 3.5" Any

NA

NA

35°CSS32

NA

2 x 3.5" S/S

4 x 3.5" S/S

4 x 2.5" S/S

35°CSP32

8 x 2.5" NVMe

NA

30°C

NA

P32

4 x 3.5" S/S

4 x 3.5" S/S

4 x 2.5" S/S

35°C

NA

P32

12 x 3.5" S/S

NA

4 x 2.5" NVMe

30°CSP32
Note
  1. When the capacity of each RDIMM is less than 64 GB, standard fans are used.

  2. When the capacity of each RDIMM is greater than or equal to 64 GB, performance fans are used.

  3. Storage configurations with a DWCM does not support ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM v1.

  4. The ambient temperature is limited to 25°C or lower when the following NVMe SSDs are installed in the front 12 x 3.5" SAS/SATA + middle 8 x 2.5" NVMe or front 12 x 3.5" SAS/SATA + rear 4 x 2.5" NVMe configuration:
    • ThinkSystem 2.5" U.2 P5336 61.44TB Read Intensive NVMe PCIe 4.0 x4 HS SSD

    • ThinkSystem 2.5" U.2 P5336 30.72TB Read Intensive NVMe PCIe 4.0 x4 HS SSD

    • ThinkSystem 2.5" U.2 P5336 15.36TB Read Intensive NVMe PCIe 4.0 x4 HS SSD

GPU configurations without FIO and 4LP

This section provides thermal information for GPU configurations without FIO and 4LP.

  • Single-wide GPU: NVIDIA A2, T1000, T400, L4

  • Double-wide GPU: NVIDIA A16, A30, A40, A100, A800, H100, H800, L40, L40S, RTX A2000, RTX A4500, RTX A6000, RTX 6000 Ada; AMD Instinct MI210

Front drive baysMax. Temp.CPU TDP (watts)Air baffleFan typeMax. GPU Qty.Max. DIMM Qty.
SWDW

8 x 2.5"

8 x 3.5"

16 x 2.5"

35°CAll supportedSP8

NA

32
35°CAll supportedGPUP

NA

332

24 x 2.5"

35°CAll supportedSP6

NA

32
35°CAll supportedGPUP

NA

332
Note
  1. The ambient temperature must be limited to 30°C or lower when three A40 GPU adapters are installed in 24 x 2.5" configurations or three 300 W GPU adapters are installed in 8 x 3.5" or 16 x 2.5" configurations.

  2. The ambient temperature must be limited to 25°C or lower in the following cases:
    • Three H100/H800/L40S GPU adapters are installed in 24 x 2.5" configurations.

    • The server is equipped with ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM v1.

  3. The 24 x 2.5" configurations do not support ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM v1.

GPU Configurations with FIO

This section provides thermal information for the GPU configurations with FIO.

  • Single-wide GPU: NVIDIA A2, T1000, T400, L4

  • Double-wide GPU: NVIDIA A16, A30, A40, A100, A800, H100, H800, L40, L40S, RTX A2000, RTX A4500, RTX A6000, RTX 6000 Ada; AMD Instinct MI210

Front drive baysMax. Temp.CPU TDP (watts)Air baffleFan typeMax. GPU Qty.Max. DIMM Qty.
T1000/T400A2/L4DW

8 x 2.5" + FIO

16 x 2.5" + FIO

35°CAll supportedGPUP

NA

NA

332
30°CAll supportedSP810

NA

32
Note
  1. The front riser (riser 5) supports only passive SW GPU adapters.

  2. The ambient temperature must be limited to 30°C or lower when three 300 W GPU adapters are installed in 8 x 2.5"+ FIO configurations or three A40 GPU adapters are installed in 16 x 2.5" + FIO configurations.

  3. The ambient temperature must be limited to 25°C or lower when three H100/H800/L40S GPU adapters are installed in 16 x 2.5" + FIO configurations.

  4. The 16 x 2.5" + FIO configurations do not support ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM v1.

Non-GPU Configurations with FIO or 4LP

This section provides thermal information for non-GPU configurations with FIO or rear 4LP riser.

Front drive baysMax. Temp.CPU TDP (watts)Air baffleFan typeMax. DIMM Qty.

8 x 2.5" + FIO/4LP

16 x 2.5" + FIO/4LP

35°CAll supportedSP32
Note
The non-GPU configurations with FIO do not support ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM v1.