Install a processor and heat sink (trained technician only)
Follow the instructions in this section to install an assembled processor and heat sink, known as a processor-heat-sink module (PHM). This task requires a Torx T30 driver. This procedure must be executed by a trained technician.
About this task
Read Installation Guidelines and Safety inspection checklist to ensure that you work safely.
Power off the server and disconnect all power cords for this task. See Power off the server.
Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-sensitive components in their static-protective packages until installation, and handling these devices with an electrostatic-discharge wrist strap or other grounding system.
Each processor socket must always contain a cover or a PHM. When removing or installing a PHM, protect the empty processor sockets with a cover.
Do not touch the processor socket or processor contacts. Processor-socket contacts are very fragile and easily damaged. Contaminants on the processor contacts, such as oil from your skin, can cause connection failures.
Do not allow the thermal grease on the processor or heat sink to come in contact with anything. Contact with any surface can compromise the thermal grease, rendering it ineffective. Thermal grease can damage components, such as the electrical connectors in the processor socket.
Remove and install only one PHM at a time. If the system board supports multiple processors, install the PHMs starting with the first processor socket.
Figure 1. Processor locations on the system board
The heat sink, processor, and processor carrier might look different from the illustrations in this section.
PHMs are keyed for the socket where they can be installed and for their orientation in the socket.
See Lenovo ServerProven website for a list of processors supported for your server. All processors on the system board must have the same speed, number of cores, and frequency.
Before you install a new PHM or replacement processor, update your system firmware to the latest level. See Update the firmware.
The following illustration shows the components of the PHM.
1 Heat sink | 9 Clips to secure processor in carrier |
2 Heat sink triangular mark | 10 Carrier triangular mark |
3 Processor identification label | 11 Processor ejector handle |
4 Nut and wire bail retainer | 12 Processor heat spreader |
5 Torx T30 nut | 13 Thermal grease |
6 Anti-tilt wire bail | 14 Processor contacts |
7 Processor carrier | 15 Processor triangular mark |
8 Clips to secure carrier to heat sink |
Go to Drivers and Software download website for ThinkSystem ST650 V3 to see the latest firmware and driver updates for your server.
Go to Update the firmware for more information on firmware updating tools.
Procedure
- When replacing a processor and reusing the heat sink:
- Remove the processor identification label from the heat sink and replace it with the new label that comes with the replacement processor.
- If there is any old thermal grease on the heat sink, wipe the thermal grease from the bottom of the heat sink with an alcohol cleaning pad.
- When replacing a heat sink and reusing the processor.
- Apply thermal grease.
- Assemble the processor and heat sink.
- Install the processor-heat-sink module into the system board socket.
After this task is completed
Reinstall the air baffle. See Install an air baffle.
Reinstall all the flash power modules, if necessary. See Install a flash power module.
Reinstall the server cover. See Install a server cover.
Reinstall the redundant power supply unit. See Install a power supply unit.
Complete the parts replacement. See Complete the parts replacement.
Demo video