Remove a processor and heat sink (trained technician only)
Follow the instructions in this section to remove an assembled processor and heat sink, known as a processor-heat-sink module (PHM). This task requires a Torx T30 driver. This procedure must be executed by a trained technician.
About this task
Read Installation Guidelines and Safety inspection checklist to ensure that you work safely.
Power off the server and disconnect all power cords for this task. See Power off the server.
Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-sensitive components in their static-protective packages until installation, and handling these devices with an electrostatic-discharge wrist strap or other grounding system.
If the server is in a rack, remove it from the rack.
If foot stands are installed on the server, pivot them inwards and lay the server on its side for easier operation.
Each processor socket must always contain a cover or a PHM. When removing or installing a PHM, protect the empty processor sockets with a cover.
Do not touch the processor socket or processor contacts. Processor-socket contacts are very fragile and easily damaged. Contaminants on the processor contacts, such as oil from your skin, can cause connection failures.
Do not allow the thermal grease on the processor or heat sink to come in contact with anything. Contact with any surface can compromise the thermal grease, rendering it ineffective. Thermal grease can damage components, such as the electrical connectors in the processor socket.
Remove and install only one PHM at a time. If the system board supports multiple processors, install the PHMs starting with the first processor socket.
The heat sink, processor, and processor carrier might look different from the illustrations in this section.
The following illustration shows the components of the PHM.
| 1 Heat sink | 9 Clips to secure processor in carrier |
| 2 Heat sink triangular mark | 10 Carrier triangular mark |
| 3 Processor identification label | 11 Processor ejector handle |
| 4 Nut and wire bail retainer | 12 Processor heat spreader |
| 5 Torx T30 nut | 13 Thermal grease |
| 6 Anti-tilt wire bail | 14 Processor contacts |
| 7 Processor carrier | 15 Processor triangular mark |
| 8 Clips to secure carrier to heat sink |
Procedure
- Make preparations for this task.
- Remove the redundant power supply unit. See Remove a power supply unit.
- Remove the server cover. See Remove the server cover.
- If necessary, remove all flash power modules. See Remove a flash power module.
- Remove the air baffle. See Remove the air baffle.
- Remove the PHM from the system board.
Fully loosen the Torx T30 nuts on the PHM in the removal sequence shown on the heat-sink label.
Pivot the anti-tilt wire bails inward.
Carefully lift the PHM from the processor socket. If the PHM cannot be fully lifted out of the socket, further loosen the Torx T30 nuts and try lifting the PHM again.Figure 3. Removal of a PHM
After this task is completed
Each processor socket must always contain a cover or a PHM. When removing or installing a PHM, protect the empty processor sockets with a cover.
If the PHM is removed as part of the system board replacement, set the PHM aside.
To reuse the processor or heat sink, separate the processor from its retainer. See Separate the processor from carrier and heat sink (trained technician only).
If you are instructed to return the component or optional device, follow all packaging instructions, and use any packaging materials for shipping that are supplied to you.
Demo video