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Separate the processor from carrier and heat sink (trained technician only)

Follow the instructions in this section to separate a processor and its carrier from an assembled processor and heat sink, known as a processor-heat-sink module (PHM). This procedure must be executed by a trained technician.

Important
This task must be operated by trained technicians.

About this task

S002
disconnect all power
CAUTION
The power-control button on the device and the power switch on the power supply do not turn off the electrical current supplied to the device. The device also might have more than one power cord. To remove all electrical current from the device, ensure that all power cords are disconnected from the power source.
Attention
  • Read Installation Guidelines and Safety inspection checklist to ensure that you work safely.

  • Power off the server and disconnect all power cords for this task. See Power off the server.

  • Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-sensitive components in their static-protective packages until installation, and handling these devices with an electrostatic-discharge wrist strap or other grounding system.

  • Do not touch the processor contacts. Contaminants on the processor contacts, such as oil from your skin, can cause connection failures.

  • Do not allow the thermal grease on the processor or heat sink to come in contact with anything. Contact with any surface can compromise the thermal grease, rendering it ineffective. Thermal grease can damage components, such as the electrical connectors in the processor socket.

Note

The heat sink, processor, and processor carrier might look different from the illustrations in this section.

Procedure

  1. Separate the processor from the heat sink and carrier.
    1. Lift the handle to release the processor from the carrier.
    2. Hold the processor by its edges; then, lift the processor from the heat sink and carrier.
    3. Without putting the processor down, wipe the thermal grease from the top of the processor with an alcohol cleaning pad; then, place the processor on a static protective surface with the processor-contact side up.
      Figure 1. Separation of a processor from the heat sink and carrier
      Separating a processor from the heat sink and carrier
      Note
      Do not touch the contacts on the processor.
  2. Separate the processor carrier from the heat sink.
    1. Release the retaining clips from the heat sink.
    2. Lift the carrier from the heat sink.
    3. Wipe the thermal grease from the bottom of the heat sink with an alcohol cleaning pad.
      Figure 2. Separation of a processor carrier the from heat sink
      Separating a processor carrier the from heat sink
      Note
      The processor carrier will be discarded and replaced with a new one.

After this task is completed

  1. Install the replacement unit(s), if necessary. See Install a processor and heat sink (trained technician only).

  2. If you are instructed to return the component or optional device, follow all packaging instructions, and use any packaging materials for shipping that are supplied to you.